“…The SiO x N y films production is compatible with current microelectronics manufacture technology, allowing the integration of optical and electronic devices in the same chip, what is an advantage over previous technologies, based on LiNbO 3 , or III-V materials as GaAs and InP [5,6]. Currently, much effort has been directed to fabricate SiO x N y films with the plasma enhanced chemical vapor deposition technique (PECVD) [2,[6][7][8] at low deposition temperatures (300-400°C) since this technique permits an accurate control of the atomic concentrations, refractive index, thickness and roughness of the deposited material only by the appropriate choice of the deposition parameters [4,6].…”