2023
DOI: 10.1016/j.ceramint.2022.12.055
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MXene fillers and silver flakes filled epoxy resin for new hybrid conductive adhesives

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Cited by 4 publications
(7 citation statements)
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“…When the temperature increased to 250 °C, the resistivity decreased significantly and reached a minimum of 65.12 μΩ·cm –1 at 30 min. This result is much better than previously published papers, ,,, ,,, , and the details are shown in Table . Nevertheless, abnormal phenomena materialized at 300 °C.…”
Section: Resultsmentioning
confidence: 48%
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“…When the temperature increased to 250 °C, the resistivity decreased significantly and reached a minimum of 65.12 μΩ·cm –1 at 30 min. This result is much better than previously published papers, ,,, ,,, , and the details are shown in Table . Nevertheless, abnormal phenomena materialized at 300 °C.…”
Section: Resultsmentioning
confidence: 48%
“…Owing to the high-temperature environment, the diffusion of oxygen atoms and reactivity enhanced, resulting in the oxidation of internal Cu-FA/DT, which leads to the deterioration of the conductivity of the device. Overall, the device still maintains a low resistivity, even lower than the original resistivity in the literature. ,,, ,,, , …”
Section: Resultsmentioning
confidence: 82%
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