Mutual intercropping-inspired co-silanization to graft well-oriented organosilane as adhesion promotion nanolayer for flexible conductors

Chen, Yi‐Hsuan; Lai, Yi-Hsiang; Wu, Ping-Heng; Chen, Li-Syuan; Lin, Yung‐Sen; Chen, Chih‐Ming

doi:10.1016/j.jiec.2019.11.017

Cited by 15 publications

(5 citation statements)

References 53 publications

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“…An overview of the different methods of improving adhesive-substrate adhesion [3][4][5]. One of the many methods of improving adhesion is the application of organosilanes [4,[12][13][14][15][16]. These are low molecular weight silicon compounds containing at least one Si-C bond.…”

Section: Introductionmentioning

confidence: 99%

Application of Organo-Modified Silica Nanoparticles to Improve the Load-Bearing Capacity of Bonded Joints of Dissimilar Steel Substrates

Guzanová,

Draganovská,

Tomáš

et al. 2024

Crystals

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The paper deals with the joining of dissimilar steels by adhesive bonding. The base materials for the experimental work were deep-drawn low-carbon steel DC04, and hot-dip galvanized HSLA steel HX340LAD+Z. Adhesive bonding was performed using rubber-based and epoxy-based adhesives. The research aimed to verify the importance of surface preparation of steel substrates using a formulation with organically modified silica nanoparticles and epoxy organic functional groups, where one end of the functional group can be incorporated into the organic binder of the coating material and the other end can be firmly bonded to substances of an inorganic nature (metals). Since the binder base of adhesives is very similar to that of coatings, verifying the performance of this surface preparation when interacting with the adhesive is necessary. The load-bearing tensile shear capacity of single-lapped joints and the resistance of the joints against corrosion-induced disbanding in a climate chamber were tested. The energy dissipated by the joints up to fracture was calculated from the load-displacement curves. Bonded joints with organosilane were compared with joints without surface preparation and joints prepared by chroman-free zirconate passivation treatment. Exposure of the joints in the climatic chamber did not cause a relevant reduction in the characteristics of the joints. Organosilicate formulation was proved effective when bonding ungalvanized steels with a rubber-based structural adhesive, where it improves the bond quality between the adhesive and the substrate.

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Section: Introductionmentioning

confidence: 99%

Application of Organo-Modified Silica Nanoparticles to Improve the Load-Bearing Capacity of Bonded Joints of Dissimilar Steel Substrates

Guzanová,

Draganovská,

Tomáš

et al. 2024

Crystals

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“…However, the poor adhesion of PPy to the substrate or electrode is usually the main problem. Several methodologies have been studied to increase electrode–PPy adhesion, such as electrode functionalization [ 12 , 13 , 14 ], optimization of the polymerization parameters [ 9 , 15 ], and adhesion promoters [ 16 , 17 , 18 ]. Alkoxysilanes are a group of compounds that have been used for a long time as adhesion promoters between inorganic surfaces and polymeric matrixes [ 19 ].…”

Section: Introductionmentioning

confidence: 99%

“…Qiao et al [ 20 ] used a silane to modify the surface of silicon, glass, and alumina substrates to increase the adhesion to in situ chemically polymerized PPy coatings. Other alkoxysilanes that have been used successfully as adhesion promoters are 3-[2-(2-aminoethylamino)ethylamino]propyl-trimethoxysilane [ 17 , 21 ], polydimethylsiloxane [ 22 ], and 3-aminopropyltrimethoxysilane [ 23 ]. Typically, these silanes are used to modify the surface of the substrates and the process is followed by PPy film deposition.…”

Section: Introductionmentioning

confidence: 99%

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Electrochemical Deposition of Polypyrrole in the Presence of Silanes as Adhesion Promoters

et al. 2023

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Polypyrrole adhesion to indium–tin oxide electrodes was improved by adding pre-hydrolyzed alkoxysilanes to the electrodeposition media. The pyrrole oxidation and film growth rates were studied by potentiostatic polymerization in acidic media. The morphology and thickness of the films were studied by contact profilometry and surface-scanning electron microscopy. The bulk and surface semiquantitative chemical composition was studied by Fourier-transform infrared spectroscopy and X-ray photoelectron spectroscopy. Finally, the adhesion was studied by scotch-tape adhesion test, where both alkoxysilanes showed a significant improvement in adhesion. We proposed a hypothesis for the improvement in adhesion, that involves the formation of siloxane material as well as in situ surface modification of the transparent metal oxide electrode.

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“…Interfacial adhesion of a heterojunction such as metal/semiconductor, metal/oxide, and metal/polymer junctions has been a challenging issue and is more critical in nanoscaled circuits. Molecular nanolayers (MNLs) based on self-assembling organosilanes are reported as the promising candidates of the adhesion enhancer. − Due to strong self-assembling capability, the organosilane molecules form a continuous two-dimensional networked structure with an ultrathin thickness of about 1–2 nm on the substrate surface, which is in possession of superior film uniformity and integrity. The organosilane molecules bear two specific functional groups on their two ends of the main backbone, three hydrolyzed silanol groups and a terminal amino group, having strong affinity toward the substrate and loaded metallic atoms, respectively. − Therefore, the organic molecular nanolayer serves as an efficient adhesive tethering the deposited metal film to the substrate.…”

Section: Introductionmentioning

confidence: 99%

Organosiloxane Monolayers Terminated with Amine Groups as Adhesives for Si Metallization

Lai

Zhang

et al. 2020

ACS Appl. Nano Mater.

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Silicon (Si) on-chip metallization was carried out through surface functionalization and electroless deposition of copper (Cu). Surface functionalization of Si was performed by grafting an amine (NH 2 )-terminated organosilane, 3-[2-(2-aminoethylamino)ethylamino]propyltrimethoxysilane (ETAS), as a nanoscaled bridge linker to adsorb catalytic polyvinylpyrrolidone-capped palladium nanoclusters (PVP-nPd) through complex reaction. The ETAS molecules bear three methoxy groups that can transform into the hydroxyl groups through hydrolysis and attach to the SiO 2 /Si substrate by hydrogen bonding. Through rapid thermal annealing (RTA) treatment, the dehydration reaction occurred and led to the formation of the covalent bonding of siloxane (Si−O−Si) between ETAS and SiO 2 /Si. The increase of the RTA temperature to 673 and 773 K caused the increase of the Si−O−Si bonding which improved the grafting orientation of ETAS as suggested by the molecular simulation. The adhesion strength of electrolessly deposited Cu film on SiO 2 /Si is boosted to 4 MPa (673 K) and 5.6 MPa (773 K) which is 60−124% enhancement compared to the sample without the RTA treatment (2.5 MPa). This shows its high feasibility induced by the organosilane nanolayer as molecular adhesive for next-generation Si metallization.

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Mutual intercropping-inspired co-silanization to graft well-oriented organosilane as adhesion promotion nanolayer for flexible conductors

Cited by 15 publications

References 53 publications

Application of Organo-Modified Silica Nanoparticles to Improve the Load-Bearing Capacity of Bonded Joints of Dissimilar Steel Substrates

Application of Organo-Modified Silica Nanoparticles to Improve the Load-Bearing Capacity of Bonded Joints of Dissimilar Steel Substrates

Electrochemical Deposition of Polypyrrole in the Presence of Silanes as Adhesion Promoters

Organosiloxane Monolayers Terminated with Amine Groups as Adhesives for Si Metallization

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