Multiscaling Approach for Non-Destructive Adhesion Studies of Metal/Polymer Composites

Füllbrandt, Marieke; Kesal, Dikran; Klitzing, Regine von

doi:10.1021/acsami.5b01949

Cited by 23 publications

(14 citation statements)

References 53 publications

(82 reference statements)

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“…Recently, metal components used in the automotive, aerospace, and microelectronics industries are increasingly replaced by polymer and composite materials. − At the same time, the importance of adhesives and adhesion technology has increased due to the diversity of used materials. − This accelerating trend requires a new reliable technology, including surface modification methods for dissimilar materials bonding. − In contrast to the intensive studies of epoxy monoliths as column fillers and separators for high-performance separation systems, − we can find no report regarding the application of epoxy monolith for adhesion in the literature. Our preliminary results revealed that epoxy monolith was available for bonding of a stainless steel (SUS430) plate and thermoplastics. , In this study, we demonstrate the validity of the epoxy monolith bonding for dissimilar material bonding between various metals and polymers.…”

Section: Introductionmentioning

confidence: 99%

Dissimilar Materials Bonding Using Epoxy Monolith

et al. 2018

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The epoxy monolith with a highly porous structure is fabricated by the thermal curing of 2,2-bis(4-glycidyloxyphenyl)propane and 4,4′-methylenebis(cyclohexylamine) in the presence of poly(ethylene glycol) as the porogen via polymerization-induced phase separation. In this study, we demonstrated a new type of dissimilar material bonding method for various polymers and metals coated with the epoxy monolith. On the basis of scanning electron microscopy (SEM) observations, the pore size and number of epoxy monoliths were evaluated to be 1.1–114 μm and 8.7–48 200 mm –2 , respectively, depending on the ratio of the epoxy resin and cross-linking agent used for the monolith fabrication. Various kinds of thermoplastics, such as polyethylene, polypropylene, polyoxymethylene, acrylonitrile–butadiene–styrene copolymer, polycarbonate bisphenol-A, and poly(ethylene terephthalate), were bonded to the monolith-modified metal plates by thermal welding. The bond strength for the single lap-shear tensile test of stainless steel and copper plates with the thermoplastics was in the range of 1.2–7.5 MPa, which was greater than the bond strength value for each bonding system without monolith modification. The SEM observation of fractured test pieces directly confirmed an anchor effect on this bonding system. The elongated deformation of the plastics that filled in the pores of the epoxy monolith, was observed. It was concluded that the bond strength significantly depended on the intrinsic strength of the used thermoplastics. The epoxy monolith bonding of hard plastics, such as polystyrene and poly(methyl methacrylate), was performed by the additional use of adhesives, solvents, and a reactive monomer. The epoxy monolith sheets were also successfully fabricated and applied to dissimilar material bonding.

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Section: Introductionmentioning

confidence: 99%

Dissimilar Materials Bonding Using Epoxy Monolith

et al. 2018

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“…During the mechanical deformation of flexible devices, the interfacial adhesion between rigid and soft materials with huge differences in moduli has always been considered as a crucial engineering problem, especially for mechanical interactions between different layers and rigid metal electrodes on elastic substrates. − Conventional solutions to improve adhesion rely on the introduction of adhesion materials, such as a thin layer of metals (Cr, Ti) or a chemically activated layer on the surface. ,,,− Inspired by natural creatures, structural modification at interfaces would constitute a valuable and effective solution to this problem. ,, For example, root systems show remarkable mechanical properties that enable plants survive in complex and hostile environments. Therefore, the structure of root systems can be introduced at interfaces between electrodes and soft substrates to realize desirable stretchability and high adhesion (Figure a).…”

Section: Structural Material-dominated Functionalization In Flexible ...mentioning

confidence: 94%

“…During the mechanical deformation of flexible devices, the interfacial adhesion between rigid and soft materials with huge differences in moduli has always been considered as a crucial engineering problem, especially for mechanical interactions between different layers and rigid metal electrodes on elastic substrates. [632][633][634][635][636][637][638][639] Conventional solutions to improve adhesion rely on the introduction of adhesion materials, such as a thin layer of metals or a chemically activated layer on the surface. 107,241,633,[640][641][642][643][644][645] Inspired by natural creatures, structural modification at interfaces would constitute a valuable and effective solution to this problem.…”

Section: Interfacial Interactions In Flexible Devicesmentioning

confidence: 99%

Nature-Inspired Structural Materials for Flexible Electronic Devices

et al. 2017

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Exciting advancements have been made in the field of flexible electronic devices in the last two decades and will certainly lead to a revolution in peoples' lives in the future. However, because of the poor sustainability of the active materials in complex stress environments, new requirements have been adopted for the construction of flexible devices. Thus, hierarchical architectures in natural materials, which have developed various environment-adapted structures and materials through natural selection, can serve as guides to solve the limitations of materials and engineering techniques. This review covers the smart designs of structural materials inspired by natural materials and their utility in the construction of flexible devices. First, we summarize structural materials that accommodate mechanical deformations, which is the fundamental requirement for flexible devices to work properly in complex environments. Second, we discuss the functionalities of flexible devices induced by nature-inspired structural materials, including mechanical sensing, energy harvesting, physically interacting, and so on. Finally, we provide a perspective on newly developed structural materials and their potential applications in future flexible devices, as well as frontier strategies for biomimetic functions. These analyses and summaries are valuable for a systematic understanding of structural materials in electronic devices and will serve as inspirations for smart designs in flexible electronics.

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“…Surfaces in close contact observed under lower resolution frequently reveal gaps when inspected at the atomic length scale ( Figure 1 ). 13 − 15 Thus, the NSCA is usually lower (at maximum equal) than the contact observed at lower resolution. 16 − 18 In conclusion, direct observation of NSCA is only possible with imaging techniques having a resolution in the length scale of the interaction forces, i.e., around 1 nm.…”

Section: Introductionmentioning

confidence: 95%

Quantification and Imaging of Nanoscale Contact with Förster Resonance Energy Transfer

Simões

Urstöger

Schennach

et al. 2021

ACS Appl. Mater. Interfaces

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Adhesion is caused by molecular interactions that only take place if the surfaces are in nanoscale contact (NSC); i.e., the distance between the surfaces is in the range of 0.1–0.4 nm. However, there are several difficulties measuring the NSC between surfaces, mainly because regions that appear to be in full contact at low magnification may show no NSC when observed at higher magnifications. Thus, the measurement area of NSC is very small with imaging techniques, and an experimental technique to evaluate NSC for large contact areas has not been available thus far. Here, we are proposing Förster resonance energy transfer (FRET) spectroscopy/microscopy for this purpose. We demonstrate that NSC in a distance range of 1–10 nm can be evaluated. Our experiments reveal that, for thin films pressed under different loads, NSC increases with the applied pressure, resulting in a higher FRET signal and a corresponding increase in adhesion force/energy when separating the films. Furthermore, we show that local variations in molecular contact can be visualized with FRET microscopy. Thus, we are introducing a spectroscopic technique for quantification (FRET spectroscopy) and imaging (FRET microscopy) of NSC between surfaces, demonstrated here for the application of surface adhesion. This could be of interest for all fields where adhesion or nanoscale surface contact are playing a role, for example, soft matter, biological materials, and polymers, but also engineering applications, like tribology, adhesives, and sealants.

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Multiscaling Approach for Non-Destructive Adhesion Studies of Metal/Polymer Composites

Cited by 23 publications

References 53 publications

Dissimilar Materials Bonding Using Epoxy Monolith

Dissimilar Materials Bonding Using Epoxy Monolith

Nature-Inspired Structural Materials for Flexible Electronic Devices

Quantification and Imaging of Nanoscale Contact with Förster Resonance Energy Transfer

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