Multiple type biosensors fabricated using the CMOS BioMEMS platform

Tsai, Hann-Huei; Lin, Chien-Hung; Juang, Ying‐Zong; Wang, I-Long; Lin, Yu‐Cheng; Wang, Ruey-Lue; Lin, Hung-Yin

doi:10.1016/j.snb.2009.01.061

Cited by 38 publications

(16 citation statements)

References 21 publications

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“…In a more recent work, a biosensor and drug delivery module were integrated onto a microfabricated system [ 196 ]. The same group has also reported the design of a CMOS BioMEMS which demonstrates the possibility of integrating multiple type biosensors [ 197 ].…”

Section: On-chip Cell Culturementioning

confidence: 99%

Cell Culture on MEMS Platforms: A Review

Tong

Choudhury

et al. 2009

IJMS

119

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Microfabricated systems provide an excellent platform for the culture of cells, and are an extremely useful tool for the investigation of cellular responses to various stimuli. Advantages offered over traditional methods include cost-effectiveness, controllability, low volume, high resolution, and sensitivity. Both biocompatible and bio-incompatible materials have been developed for use in these applications. Biocompatible materials such as PMMA or PLGA can be used directly for cell culture. However, for bio-incompatible materials such as silicon or PDMS, additional steps need to be taken to render these materials more suitable for cell adhesion and maintenance. This review describes multiple surface modification strategies to improve the biocompatibility of MEMS materials. Basic concepts of cell-biomaterial interactions, such as protein adsorption and cell adhesion are covered. Finally, the applications of these MEMS materials in Tissue Engineering are presented.

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Section: On-chip Cell Culturementioning

confidence: 99%

Cell Culture on MEMS Platforms: A Review

Tong

Choudhury

et al. 2009

IJMS

119

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“…As shown in figure 4(a), the thin-film stacking and patterning were prepared by foundries [20]. The CMOS layers were prepared by the CMOS foundry TSMC, and the deposition and patterning of Ti/Au seed layers were fabricated by the MEMS foundry apm.…”

Section: Post-cmos Fabrication and Resultsmentioning

confidence: 99%

Post-CMOS selective electroplating technique for the improvement of CMOS-MEMS accelerometers

Liu

Tsai

Tang

et al. 2011

J. Micromech. Microeng.

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This study presents a simple approach to improve the performance of the CMOS-MEMS capacitive accelerometer by means of the post-CMOS metal electroplating process. The metal layer can be selectively electroplated on the MEMS structures at low temperature and the thickness of the metal layer can be easily adjusted by this process. Thus the performance of the capacitive accelerometer (i.e. sensitivity, noise floor and the minimum detectable signal) can be improved. In application, the proposed accelerometers have been implemented using (1) the standard CMOS 0.35 μm 2P4M process by CMOS foundry, (2) Ti/Au seed layers deposition/patterning by MEMS foundry and (3) in-house post-CMOS electroplating and releasing processes. Measurements indicate that the sensitivity is improved 2.85-fold, noise is decreased near 1.7-fold and the minimum detectable signal is improved from 1 to 0.2 G after nickel electroplating. Moreover, unwanted structure deformation due to the temperature variation is significantly suppressed by electroplated nickel.

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“…It should be noted that the position of the intedigitated electrodes is on the top of the chopper DDA and OOK TX/RX to form the proposed pseudo-3D architecture. On the top of interdigitated electrodes, a layer of gold is e-beam evaporated to form a good contact to the sensing material [ 18 ]. Then the sensing material is coated on the top of electrodes by micro-stamping technology.…”

Section: Methodsmentioning

confidence: 99%

A Fully Integrated Humidity Sensor System-on-Chip Fabricated by Micro-Stamping Technology

Huang

et al. 2012

Sensors

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A fully integrated humidity sensor chip was designed, implemented, and tested. Utilizing the micro-stamping technology, the pseudo-3D sensor system-on-chip (SSoC) architecture can be implemented by stacking sensing materials directly on the top of a CMOS-fabricated chip. The fabricated sensor system-on-chip (2.28 mm × 2.48 mm) integrated a humidity sensor, an interface circuit, a digital controller, and an On-Off Keying (OOK) wireless transceiver. With low power consumption, i.e., 750 μW without RF operation, the sensitivity of developed sensor chip was experimentally verified in the relative humidity (RH) range from 32% to 60%. The response time of the chip was also experimentally verified to be within 5 seconds from RH 36% to RH 64%. As a consequence, the implemented humidity SSoC paves the way toward the an ultra-small sensor system for various applications.

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Multiple type biosensors fabricated using the CMOS BioMEMS platform

Cited by 38 publications

References 21 publications

Cell Culture on MEMS Platforms: A Review

Cell Culture on MEMS Platforms: A Review

Post-CMOS selective electroplating technique for the improvement of CMOS-MEMS accelerometers

A Fully Integrated Humidity Sensor System-on-Chip Fabricated by Micro-Stamping Technology

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