Multiple-chip package embedded on compound board for light emitting diode

Abstract

A simple and efficient packaging technique with aluminium-core printed circuit board component embedded copper reflectors is presented for fabricating high-power white light emitting diode (LED) arrays. Three-dimensional finite element simulation and dynamic infrared imaging for analysis of the packaged nine-chips LED array are carried out to investigate the thermal and optical properties. The results show the method, which obtained a luminous efficiency of 126 lm/W and thermal resistance of 3.4 K/W, is suitable for high efficiency and low-cost LED based solid-state lighting.

A review on light-emitting diode based automotive headlamps

“…And this leads to a demand on LED array module which is a module integrating multiple LEDs as the light source to achieve hundreds of lumen output [32][33][34][35]. However, the design of the LED array module is a multiple physical field problem.…”

“…3 (right), another potential option was proposed, where the conductive path is through the p-GaN/pad and n-GaN/pad rather than the substrate. In addition, the chip-on-board (COB) technology [33,44], where the chip is bonded on the board (e.g. AlN) directly, become a mainstream to improve the heat management, and now the thermal resistance from the junction to board has been reduced to 1.3 1C/W [28].…”

Yield analysis of large‐area high‐power single‐chip GaN‐based light‐emitting diodes with network design

“…However, higher‐power applications such as projection, fluorescence microscopy and general lighting require more powerful LEDs with higher optical output power. Although high‐performance LED light sources can be achieved with multiple chip packaging 7, it is desirable to manufacture the LED light source with a single LED chip to reduce the packaging cost. In order to obtain considerable light output power in only one chip, large LED chip size and high operation power are commonly adopted.…”

Investigation on Junction Temperatures of Multichip-on-Board Packaged Light Emitting Diodes with Configurable Electrical Power

“…Numerous researchers have studied the junction temperature of the LED array in the LED lighting system 5) -8) . The experimental test includes the forwardvoltage method 9) , the thermal infrared imager 10) , and the thermal resistance measurement 11) . The finite element method (FEM) simulation codes 12) are adopted to evaluate the junction temperature of the LED array during the design stage.…”

“…The prototype consists of a LED array and a configurable pulse-width modulation (PWM) driver unit. The LED array is packaged by the COB structure 10) with three LEDs, and a C8051F350 microprocessor that controls the PWM duties of the three PWM current re-sources in the driver unit. Figure 1 shows the photos of the prototype.…”