Multiphysic Simulations for MEMS Sensor Package

Sarto, Marco Del; Duca, Roseanne; Maierna, A.; Manca, N.; Ghidoni, M. O.; Napolitano, Teresa

doi:10.1109/eptc47984.2019.9026616

Cited by 5 publications

(2 citation statements)

References 9 publications

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“…Warpage oriented package simulations have been set up constraining three out of four package corners (free condition) and ranging the temperature according to the investigated process steps [7].…”

Section: A Pakage Design and Simulationmentioning

confidence: 99%

See 1 more Smart Citation

From MEMS Strip to MEMS Unit: a Comprehensive Simulation Approach to Warpage

Ratti,

Simoncini,

Adolfo

et al. 2024

IMAPSource Proceedings

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The paper suggests a simulation flow methodology suitable for MEMS package designers that can help R&D teams to develop industrially feasible products by achieving consistent warpage prediction results, both at unit and strip levels. Striplevel- wise, one of the most important findings of this activity is the direct impact of raw material selection. Unit-level-wise, it allows checking a priori and in different conditions (inside the socket or mounted on a PCB for example) stress distribution on different elements of the assembled MEMS unit.

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Section: A Pakage Design and Simulationmentioning

confidence: 99%

“…μDIC is a widely used and well-known optical measuring technique to evaluate strain and displacement on a specimen [8,9]. In our application, a stereo microscope has been exploited.…”

Section: B μDic Measurements and Correlationmentioning

confidence: 99%