2020
DOI: 10.1016/j.matdes.2019.108252
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Multiphase identification in Ni–PbTe contacts by EBSD and aberration-corrected STEM

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Cited by 4 publications
(2 citation statements)
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“…Cu and Ni are usually used as electrodes due to their high electrical conductivity and good wettability with solders . However, the solubility of both Cu and Ni in PbTe is high, , much higher than the amounts added in PbTe in this work. This explains that no Cu or Ni particles were observed in the hot-pressed PbTe pellets here.…”
Section: Resultsmentioning
confidence: 99%
“…Cu and Ni are usually used as electrodes due to their high electrical conductivity and good wettability with solders . However, the solubility of both Cu and Ni in PbTe is high, , much higher than the amounts added in PbTe in this work. This explains that no Cu or Ni particles were observed in the hot-pressed PbTe pellets here.…”
Section: Resultsmentioning
confidence: 99%
“…Additionally, electron diffraction has been extensively used as a complementary technique to elucidate crystallographic information from materials under various modalities such as selected area electron diffraction, microdiffraction, nanobeam diffraction (NBD), or convergent beam electron diffraction (CBED) and electron backscattering diffraction (EBSD). [ 2 ] Besides, coupled with STEM, electron diffraction can also be collected while the beam continuously scans the sample using precession electron diffraction (PED) coupled with one of the abovementioned detectors can lead to get 4D‐STEM data which have been recently developed to elucidate structure at smaller scales, but further development needs to be done in the collection and analysis of big data. [ 3 ] EBSD provides the analysis of crystalline phases, strain, and crystal orientation mapping at larger scale (microns), while PED‐based method produces similar maps but reaching nanometric resolution, both methodologies are limited by the probe size, one can classify the ranges of the analyzed area in squared microns and nanometers, respectively.…”
Section: Introductionmentioning
confidence: 99%