Multilayer Ceramic Circuit Board with a Copper Conductor

Low temperature synthesis of anorthite based glass-ceramics via sintering and crystallization of glass-powder compacts

“…[1][2][3] Anorthite is a potential material for LTCC substrates due to its lower coefficient of thermal expansion and lower dielectric constant than alumina. 4 In these applications, sintering of ceramics should occur at about 950 • C, which is lower than the melting points of cupper, silver or gold, since the use of metals results in less heat generation during operation due to their high thermal conductivity.…”

The effect of TiO2 and P2O5 on densification behavior and properties of Anortite-Diopside glass-ceramic substrates

“…So far, alumina ceramics have been the most widely applied substrates in RF applications mainly due to their relatively low dielectric constant at high frequency, 9. However, low temperature co-fired ceramic (LTCC) have been recognized as a potential alternative because of its high signal propagation, good reliability, low cost and the possibility of co-firing these substrates with less expensive conductors like Ag and Cu [1][2][3]. LTCC process is able to produce multilayer structures where cavities and heat sinks can be easily incorporated making easier the microelectronic miniaturization [4,5].…”

Thermal degradation of poly(vinyl butyral) in alumina, mullite and silica composites

“…In addition, the residual carbon left behind after thermal degradation affects optical, electrical and mechanical properties of the substrate. The residual carbon in excess of 50 to 100 ppm would decrease the density and also affect many substrate properties like flexural strength, breakdown voltage [1] and dielectric constant [2]. In order to optimize the binder removal processes, some attention has been paid to studies such as polymer degradation mechanism [3][4][5], interactions of ceramics and binders [6][7][8], and effect of processing variables [9].…”