2013
DOI: 10.1109/jstqe.2012.2237387
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Multidimensional Conduction-Band Engineering for Maximizing the Continuous-Wave (CW) Wallplug Efficiencies of Mid-Infrared Quantum Cascade Lasers

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Cited by 42 publications
(39 citation statements)
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“…While good output powers and WPEs have been achieved, long-term reliability of these devices under RT CW operation remains a critical problem [5,6]. These devices are prone to catastrophic breakdown owing to reasons that are not entirely understood, but are likely related to thermal stress that stems from prolonged highpower operation [5].…”
Section: B Recent Developments In High-power Qclsmentioning
confidence: 99%
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“…While good output powers and WPEs have been achieved, long-term reliability of these devices under RT CW operation remains a critical problem [5,6]. These devices are prone to catastrophic breakdown owing to reasons that are not entirely understood, but are likely related to thermal stress that stems from prolonged highpower operation [5].…”
Section: B Recent Developments In High-power Qclsmentioning
confidence: 99%
“…In addition to improved device lifetime, we seek better CW temperature performance (higher characteristic temperatures T 0 and T 1 , defined below) [6]. The first aspect is a weaker temperature dependence of the threshold current density.…”
Section: B Recent Developments In High-power Qclsmentioning
confidence: 99%
See 1 more Smart Citation
“…While good operating powers and WPEs have been achieved in devices close to 5 µm wavelengths, long-term reliable RT CW operation at high powers (in excess of a few hundred mW) remains a challenge due to high thermal stress [13,14] that is worst in short-wavelength devices that have high strain and high thermal impedance mismatch between layers [10,11,15,16]. In addition to improved device longevity, what is needed is better CW temperature performance, with weaker temperature dependencies of the threshold current density J th ∼ exp (T/T 0 ), with T 0 being the characteristic temperature, and of the differential quantum efficiency η ∼ exp (−T/T 1 ), also known as the slope efficiency, with a characteristic temperature T 1 [14].…”
Section: Introductionmentioning
confidence: 99%
“…In addition to improved device longevity, what is needed is better CW temperature performance, with weaker temperature dependencies of the threshold current density J th ∼ exp (T/T 0 ), with T 0 being the characteristic temperature, and of the differential quantum efficiency η ∼ exp (−T/T 1 ), also known as the slope efficiency, with a characteristic temperature T 1 [14]. Recently, deep-well structures with tapered-barrier active regions have demonstrated significant improvements in the T 0 and T 1 values with respect to those in the conventional 4.6 µm device [8], underscoring that suppression of leakage paths plays a key role in temperature performance [4,14,17]. However, the microscopic mechanisms and leakage pathways that contribute to these empirical performance parameters remain unclear.…”
Section: Introductionmentioning
confidence: 99%