Multichip optical hybrid integration technique with planar lightwave circuit platform

Hashimoto, Toshikazu; Nakasuga, Yoshinori; Yamada, Yoshiaki; Terui, H.; Yanagisawa, Masahiro; Akahori, Y.; Tohmori, Y.; Kato, Kazutoshi; Suzuki, Yasuo

doi:10.1109/50.701403

Cited by 51 publications

(15 citation statements)

References 26 publications

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“…Assuming that , that the hinge width is comparable to the flap thickness (both might be m), and that gravitational terms due to the shape of the drop can be neglected, we obtain a simple expression for the maximum breadth of flap that can be lifted (12) For silicon, kg/m . This gives m, or roughly 5 mm.…”

Section: Comparison With the Gravitational Counter-torquementioning

confidence: 99%

“…These techniques have been adapted to the more demanding environment of optical packaging, in what is widely referred to as "silicon optical bench technology". Surface tension has been used for alignment of hybrid integrated semiconductor laser diodes [10], [11], silica based planar lightwave circuits [12], and photodiodes [13]. The first two applications involve coupling of waveguide components, when micron-level misalignment creates significant optical loss.…”

mentioning

confidence: 99%

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Surface tension-powered self-assembly of microstructures - The state-of-the-art

Syms¹,

Yeatman²,

Bright

et al. 2003

J. Microelectromech. Syst.

320

238

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Abstract-Because of the low dimensional power of its force scaling law, surface tension is appropriate for carrying out reshaping and assembly in the microstructure size domain. This paper reviews work on surface tension powered self-assembly of microstructures. The existing theoretical approaches for rotational assembly are unified. The demonstrated fabrication processes are compared. Mechanisms for accurately determining the assembled shape are discussed, and the limits on accuracy and structural distortion are considered. Applications in optics, electronics and mechanics are described. More complex operations (including the combination of self-assembly and self-organization) are also reviewed.[926]Index Terms-Capillary force, microelectromechanical systems (MEMS), microsystems, microoptoelectromechanical systems (MOEMS), self-assembly, surface tension.

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Section: Comparison With the Gravitational Counter-torquementioning

confidence: 99%

mentioning

confidence: 99%

Surface tension-powered self-assembly of microstructures - The state-of-the-art

Syms¹,

Yeatman²,

Bright

et al. 2003

J. Microelectromech. Syst.

320

238

View full text Add to dashboard Cite

show abstract

“…The passive alignment technique, which eliminates complicated precise optical axis alignment and removes the need for closed-loop optimization, can solve this problem. Three types of passive alignment techniques have already been developed: mechanical contact alignment [10], visual index alignment using alignment marks [11][12][13], and solder bump self-alignment [14]. We adopted index alignment using alignment marks.…”

Section: A Passive Optical Alignmentmentioning

confidence: 99%

Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor

Higurashi

Sawada

Suga

2009

2009 International Symposium on Optomechatronic Technologies

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This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surfaceactivated bonding at a relatively low bonding temperature of 150˚C. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm × 2.8 mm × 1 mm thick) was fabricated. The feasibility of displacement measurement based on grating interferometer was demonstrated using the prototype microsensor.

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“…Especially, the fabrication process of SS-LD and WG-PD is more complicated than that of Fabry-Perot LD (FP-LD) and surface-receiving PD (SR-PD). Moreover, multichip bonding can destabilize bonding accuracy due to the property of PLC platform with high thermal conductivity [4]. Therefore, when the flip-chip bonding process is limited to a single bonding, a costcompetitive hybrid transceiver can be successfully packaged through the high bonding accuracy of FP-LD.…”

Section: Introductionmentioning

confidence: 99%