Multi-wire fast slicing for photovoltaic applications

Smith, M. B.; Schmid, F.; Khattak, C. P.; Teale, L.; Summers, J.G.

doi:10.1109/pvsc.1991.169355

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Fixed Abrasive Slicing Technology (Fast)1

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“…FAST was introduced to sapphire slicing by Crystal Systems, Inc. (Salem, Massachusetts, USA) in 1999 [23,[29][30][31][32][33]. Figure 6 illustrates the FAST process.…”

Section: Fixed Abrasive Slicing Technology (Fast)mentioning

confidence: 99%

Machining processes for sapphire wafers: a literature review

Pei

Funkenbusch

2011

Proceedings of the Institution of Mechanical Engineers, Part B:

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Sapphire wafers are widely used as the substrates for fabricating GaN light-emitting diodes (LEDs). The quality of LEDs depends directly on the quality of the sapphire wafers. A series of machining processes is required to turn sapphire barstock into wafers with the desired geometry and surface quality. This paper reviews the literature on various machining processes for sapphire wafers: slicing (including outer diameter cut-off grinding, inner diameter cut-off grinding, loose abrasive multi-wire sawing, fixed abrasive slicing, and fixed abrasive multi-wire sawing), flattening (including lapping and grinding), and surface finishing (including mechanical polishing and chemical mechanical polishing). New machining technologies are also introduced.

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“…FAST was introduced to sapphire slicing by Crystal Systems, Inc. (Salem, Massachusetts, USA) in 1999 [23,[29][30][31][32][33]. Figure 6 illustrates the FAST process.…”

Section: Fixed Abrasive Slicing Technology (Fast)mentioning

confidence: 99%

Machining processes for sapphire wafers: a literature review

Pei

Funkenbusch

2011

Proceedings of the Institution of Mechanical Engineers, Part B:

View full text Add to dashboard Cite

show abstract

Multi-wire fast slicing for photovoltaic applications

Cited by 1 publication

References 1 publication

Machining processes for sapphire wafers: a literature review

Machining processes for sapphire wafers: a literature review

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