Multi-shaped beam proof of lithography

Slodowski, Matthias; Doering, Hans-Joachim; Dorl, Wolfgang; Stolberg, Ines A.

doi:10.1117/12.846529

Cited by 9 publications

(13 citation statements)

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“…Corresponding PEC functions have been applied using 250 dose classes. All applied lithography settings were reasonably proven in the first exposure results [2] . The write time results refer to double pass exposure and cover the entire mask including frame, marks, labels etc.…”

Section: Comparison Of Shot Counts and Write Timesmentioning

confidence: 98%

“…Beamlets are elements of the multi shaped beam array. The MSB matrix [1] , [2] may, for instance, consist of 8 x 8 beamlets (MSB64) or 16 x 16 beamlets (MSB256). Higher numbers of beamlets are taken into account for Direct Write (DW) applications [8] .…”

Section: Comparison Of Shot Counts and Write Timesmentioning

confidence: 99%

“…Earlier publications explain in detail the working principle of the Vistec Multi Shaped Beam (MSB) technology [1] and demonstrate first lithography results on test and customer patterns [2] . The MSB working principle (see Figure 1) is appropriate for both wafer direct write and photomask write applications.…”

Section: Introductionmentioning

confidence: 99%

“…Multi Shaped Beam technology (MSB) for photomask patterning using a matrix of small beamlets instead of just one shaped beam, is a very effective and evolutionary enhancement of the well established Variable Shaped Beam (VSB) technique. Its technical feasibility has been successfully demonstrated [2] . One advantage of MSB is the productivity gain over VSB with decreasing critical dimensions (CDs) and increasing levels of optical proximity correction (OPC) or for inverse lithography technology (ILT) and source mask optimization (SMO) solutions.…”

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confidence: 97%

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Multi-shaped e-beam technology for mask writing

et al. 2010

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Photomask lithography for the 22nm technology node and beyond requires new approaches in equipment as well as mask design. Multi Shaped Beam technology (MSB) for photomask patterning using a matrix of small beamlets instead of just one shaped beam, is a very effective and evolutionary enhancement of the well established Variable Shaped Beam (VSB) technique. Its technical feasibility has been successfully demonstrated [2] . One advantage of MSB is the productivity gain over VSB with decreasing critical dimensions (CDs) and increasing levels of optical proximity correction (OPC) or for inverse lithography technology (ILT) and source mask optimization (SMO) solutions. This makes MSB an attractive alternative to VSB for photomask lithography at future technology nodes.The present paper describes in detail the working principles and advantages of MSB over VSB for photomask applications. MSB integrates the electron optical column, x/y stage and data path into an operational electron beam lithography system. Multi e-beam mask writer specific requirements concerning the computational lithography and their implementation are outlined here. Data preparation of aggressive OPC layouts, shot count reductions over VSB, data path architecture, write time simulation and several aspects of the exposure process sequence are also discussed. Analysis results of both the MSB processing and the write time of full 32nm and 22nm node critical layer mask layouts are presented as an example.

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Section: Comparison Of Shot Counts and Write Timesmentioning

confidence: 98%

Section: Comparison Of Shot Counts and Write Timesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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confidence: 97%

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Multi-shaped e-beam technology for mask writing

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“…The basic concept of MSB follows the idea to parallelize the established single-VSB beam generation in one column [6]. This approach retains many proven components, concepts and algorithms which have been developed over many years and demonstrated performance for industrial applications in mask-and wafer-writing.…”

Section: Basic Approachmentioning

confidence: 99%

Multi-shaped-beam (MSB): an evolutionary approach for high throughput e-beam lithography

et al. 2010

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The development of next-generation lithography (NGL) such as EUV, NIL and maskless lithography (ML2) are driven by the half pitch reduction and increasing integration density of integrated circuits down to the 22nm node and beyond. For electron beam direct write (EBDW) several revolutionary pixel based concepts have been under development since several years. By contrast an evolutionary and full package high throughput multi electron-beam approach called Multi Shaped Beam (MSB), which is based on proven Variable Shaped Beam (VSB) technology, will be presented in this paper.In the recent decade VSB has already been applied in EBDW for device learning, early prototyping and low volume fabrication in production environments for both silicon and compound semiconductor applications. Above all the high resolution and the high flexibility due to the avoidance of expensive masks for critical layers made it an attractive solution for advanced technology nodes down to 32nm half pitch.The limitation in throughput of VSB has been mitigated in a major extension of VSB by the qualification of the cell projection (CP) technology concurrently used with VSB. With CP more pixels in complex shapes can be projected in one shot, enabling a remarkable shot count reduction for repetitive pattern.The most advanced step to extend the mature VSB technology for higher throughput is its parallelization in one column applying MEMS based multi deflection arrays. With this Vistec MSB technology, multiple shaped beamlets are generated simultaneously, each controllable individually in shape size and beam on time. Compared to pixel based ML2 approaches the MSB technology enables the maskless, variable and parallel projection of a large number of pixels per beamlet times the number of beamlets.Basic concepts, exposure examples and performance results of each of the described throughput enhancement steps will be presented.

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2018

Principles of Electron Optics

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Multi-shaped beam proof of lithography

Cited by 9 publications

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Multi-shaped e-beam technology for mask writing

Multi-shaped e-beam technology for mask writing

Multi-shaped-beam (MSB): an evolutionary approach for high throughput e-beam lithography

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