Multi-scale surface simulation of the KDP crystal fly cutting machining

Chen, Wanqun; Liang, Yingchun; Luo, Xichun; Sun, Yazhou; Wang, Heran

doi:10.1007/s00170-014-5748-0

Cited by 19 publications

(11 citation statements)

References 16 publications

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“…5. The machine tool must be designed and optimized to ensure high static and dynamic performance, which determines the machined surface quality [13,30]. It consists of a base, column, X slide, Y slide, Z slide, vertical spindle, grinding axis, grinding wheel, pitching mechanism, rotary table, and other driving units.…”

Section: A Hybrid Methods For Chamfering Of Kdp Crystalmentioning

confidence: 99%

A hybrid method for crackless and high-efficiency ultraprecision chamfering of KDP crystal

Chen¹,

Chen²,

Wang³

2016

Int J Adv Manuf Technol

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To enhance the optical performance of the optics used in inertial confinement fusion (ICF), the edges of the large-sized KDP crystal need to be removed to form chamfered faces with high surface quality (RMS <5 nm). Fly cutting with single point diamond tool has been widely used to process potassium dihydrogen phosphate (KDP) to achieve extremely high surface quality. However, the depth of cut (DOC) of fly cutting is usually several microns, which results in very low machining efficiency for the chamfering of KDP crystal as the amount of materials to be removed is in the order of millimeter. To overcome this problem, this paper proposes a hybrid machining method by combining precision grinding with fly cutting to achieve crackless and high-efficiency ultraprecision chamfering of KDP crystal. In addition, a combined machine tool has been developed, and experiments have been carried out to determine the optimal machining procedures and verify the effectiveness of the proposed method. Experimental results show that the machining efficiency can be improved by nearly five times using the proposed method to produce the same machined surface quality as that of the traditional fly cutting process.

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Section: A Hybrid Methods For Chamfering Of Kdp Crystalmentioning

confidence: 99%

A hybrid method for crackless and high-efficiency ultraprecision chamfering of KDP crystal

Chen¹,

Chen²,

Wang³

2016

Int J Adv Manuf Technol

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“…Fly cutting of large crystals. Fly cutting is an intermittent cutting process in which a diamond tool is mounted to the end of a spindle to intermittently cut a workpiece [88][89][90][91]. This process has important applications in the production of large flat surfaces.…”

Section: New Developments In Ultraprecision Manufacturingmentioning

confidence: 99%

Manufacturing technologies toward extreme precision

Zhang

Yan

Kuriyagawa

2019

Int. J. Extrem. Manuf.

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Precision is one of the most important aspects of manufacturing. High precision creates high quality, high performance, exchangeability, reliability, and added value for industrial products. Over the past decades, remarkable advances have been achieved in the area of high-precision manufacturing technologies, where the form accuracy approaches the nanometer level and surface roughness the atomic level. These extremely high precision manufacturing technologies enable the development of high-performance optical elements, semiconductor substrates, biomedical parts, and so on, thereby enhancing the ability of human beings to explore the macro- and microscopic mysteries and potentialities of the natural world. In this paper, state-of-the-art high-precision material removal manufacturing technologies, especially ultraprecision cutting, grinding, deterministic form correction polishing, and supersmooth polishing, are reviewed and compared with insights into their principles, methodologies, and applications. The key issues in extreme precision manufacturing that should be considered for future R&D are discussed.

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“…Xiao et al [ 25 ] studied the mechanism of BDT, proposed a mechanical model, and analyzed the relationship between the UCT, deformation and stress level in the elastic stage of the periodic chip formation process. Chen et al [ 26 ] proposed a new method to model and simulate the surface formation of KDP crystals in the process of fly-cutting at the macroscales, microscales and nanoscales, in order to establish evaluation criteria of different spatial frequency regions. In the molecular dynamics simulation of the nano-cutting process, Chen et al [ 27 ] found that the damage type changed from the line defect to the phase transition with the increase of cutting speed.…”

Section: Introductionmentioning

confidence: 99%

Effect of Pre-Existing Micro-Defects on Cutting Force and Machined Surface Quality Involved in the Ball-End Milling Repairing of Flawed KDP Crystal Surfaces

et al. 2022

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When serving in extremely high-power laser conditions, KH2PO4 (KDP) surfaces are susceptible to incur laser damage points (also known as defects). Using micro-ball end milling cutters to repair and remove the pre-existing damage points on the flawed KDP crystal surface is the most effective method to control the growth of laser damage points on KDP crystal surfaces and prolong their service life. However, there are various forms of micro-defects (such as pits, scratches and brittle fractures) around the laser damage points on KDP crystal surfaces which possess remarkable effects on the micro-milling repair process and consequently deteriorate the repair quality. In this work, combined with nano-indentation experiments, elastic–plastic mechanics and fracture mechanics theory, a constitutive model considering the anisotropic property of KDP crystals and a three-dimensional (3D) finite element model (FEM) were established to simulate the cutting force and surface topography involved in the ball-end milling repairing of flawed KDP crystal surfaces. Besides, the micro-milling experiments were conducted to evaluate the change of cutting force and machined surface quality in the presence of micro-defects with various feed rates. The results show that micro-defects would induce the fluctuation of cutting force and a change of the undeformed cutting thickness (UCT) in the process of repairing the damage points on the crystal surface, which would lead to the brittle–ductile transition (BDT) and affect the machined surface quality. The machined surface quality was found to be deteriorated by the pre-existing micro-defects when the UCT was small (the UCT was less than 375 nm). On the contrary, brittle mode cutting in the local area can be transformed into ductile mode cutting, resulting in an improvement of repaired surface quality that is exhibited by the cutting force and microtopography. This work has great theoretical significance and engineering practical value for the promotion and application of micro-milling repairing technology in the practical manufacturing and operation of KDP optics applied to high-power laser systems.

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Multi-scale surface simulation of the KDP crystal fly cutting machining

Cited by 19 publications

References 16 publications

A hybrid method for crackless and high-efficiency ultraprecision chamfering of KDP crystal

A hybrid method for crackless and high-efficiency ultraprecision chamfering of KDP crystal

Manufacturing technologies toward extreme precision

Effect of Pre-Existing Micro-Defects on Cutting Force and Machined Surface Quality Involved in the Ball-End Milling Repairing of Flawed KDP Crystal Surfaces

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