“…Due to the hard and brittle nature of ceramics, their poor thermal conductivity and wear resistance make them very difficult to machine. Currently, ceramic processing is mainly based on grinding with diamond tools (mainly grinding wheels) [1]. The processed surface generally has textural characteristics related to the processing method as well as broken, scratched, cracked, and other damage, and the geometric structure of these rough surfaces has a close relationship with many surface features, such as the following: in the mechanical industry, the surface shape characteristics of the processing, not only on the entire system of contact stiffness, contact strength, friction and wear, and the nature of the fit, as well as transmission accuracy, have a great impact; thus, in the electronics industry, the roughness of the silicon wafer surface has an increasing impact on the thin film capacitance and thin film resistance in the integrated circuit, thus affecting the performance and yield of the entire integrated circuit device; in the biomedical manufacturing industry, the surface morphology of artificial joints and other artificial organs will directly affect the flexibility and life of the joints; in the aerospace manufacturing industry, the surface shape of optical components, even if only a small microscopic bump, will cause light scattering and make the performance of the optical system worse, thus affecting the performance of the whole system [2].…”