Multi-Physics Modelling for Microelectronics and Microsystems - Current Capabilities and Future Challenges

Bailey, C.; Lu, Hua; Stoyanov, Stoyan; Hughes, Michael S.; Yin, Chunyan; Gwyer, D.

doi:10.1109/esime.2007.360048

Cited by 5 publications

(4 citation statements)

References 8 publications

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“…Specifying of boundary conditions are not easy". To address this, although powerful and advanced solvers have been developed recently to efficiently solve nonlinear partial differential equations, which is often used in modelling [18], the overall simulation speed is still less. Hence, the interface to a multi-core simulation environment, where the computationally intensive tasks can be divided and processed in parallel using several cores is highlighted as an area demanding attention to enable faster MPSS simulations.…”

Section: B Software Improvement and Future Trendmentioning

confidence: 99%

“…The use of MPSS for advanced industrial applications has been demonstrated in [16] and [17], clearly showing the dependence on fast and accurate simulation models based on the FEM. In addition, the need for closer coupling, multi-discipline analysis, multi-scale modelling, and better integration with computer-aided design (CAD) software is highlighted in [18] and [19]. A survey [20] has revealed that there is a significant need identified by the software users to improve the reliability monitoring methods of power electronics simulations.…”

Section: Introductionmentioning

confidence: 99%

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Questionnaire-Based Discussion of Finite Element Multiphysics Simulation Software in Power Electronics

Song

Pickert

et al. 2018

IEEE Trans. Power Electron.

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A questionnaire-based survey was carried out to determine the customers' requirements and the future expectations of Multi-Physics Simulation Software (MPSS) based on the finite element method (FEM) in various applications of power electronics. For this survey, several responses was collected from MPSS users in the power electronic industry and academia. Based on the survey, the current features of MPSS are analyzed, and the recent advancements made are ascertained. Also, the drawbacks of the current MPSS offerings are discussed from academic and industrial perspectives. Different user groups have highlighted the need to significantly enhance the sophistication of MPSS. It is concluded that the current limitations to MPSS are simulation speed and accuracy and there are bottlenecks in the software interface. Some suggestions are given to overcome the current drawbacks of MPSS.

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Section: B Software Improvement and Future Trendmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Questionnaire-Based Discussion of Finite Element Multiphysics Simulation Software in Power Electronics

Song

Pickert

et al. 2018

IEEE Trans. Power Electron.

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“…The works, which are dealing with the numerical modelling of the stencil printing presumed that the squeegees kept their initial angle for the whole printing time. This was the case in the works of Glinski et al (2000;2001), in the work of Desmulliez et al (2004) and Bailey et al (2007). To further enhance the accuracy of the numerical modelling of stencil printing processes, we decided to determine the attack angle during stencil printing for squeegees with different initial geometries.…”

Section: Introductionmentioning

confidence: 99%

Investigating the attack angle of squeegees with different geometries

Krammer

Jakab

Illés

et al. 2018

SSMT

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Purpose The attack angle of stencil printing squeegees with different geometries was analysed using finite element modelling. Design/methodology/approach A finite element model (FEM) was developed to determine the attack angle during the stencil printing. The material properties of the squeegee were included in the model according to the parameters of steel AISI 4340, and the model was validated by experimental measurements. Two geometric parameters were investigated; two different unloaded angles (45° and 60°) and four overhang sizes of the squeegee (6, 15, 20 and 25 mm). Findings It was found that the deflection of the blade is nearly homogenous along the length of the squeegee. This implies that the attack angle does not change significantly along the squeegee length. The results showed significant differences between the initial and the attack angle. For example, the angle of the squeegee with 15 mm overhang size and with 60° initial angle decreased by more than 5° for a specific squeegee force of 0.3 N/mm; resulting in an attack angle of 53.4°. Originality/value The attack angle during the printing is considerably lower than the initial angle as a result of the printing force. The papers, which were dealing with the numerical modelling of the stencil printing presumed that the squeegees were having their initial angle. This could have led to invalid numerical results. Therefore, we decided to investigate the attack angle during stencil printing for squeegees with different initial geometries to enhance the numerical modelling of stencil printing.

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“…In fact, the formation of IMC microstructure is a procedure of alloy melting, diffusion and metallographic structure re‐formation, dominated by the heat quantity of solder absorbed. Evidently, reflow time and temperature have an intercrossing contribution to the heat quantity produced (Bailey et al , 2007; Artur et al , 2007; Fan et al , 2004). However, few publications were found to study the coupling effect of the two process parameters on the formation of IMC microstructure.…”

Section: Introductionmentioning

confidence: 99%

Reflow profile optimization of μBGA solder joints considering reflow temperature and time coupling

Tao

Yin

Ding

et al. 2009

Soldering &Amp; Surface Mount Technology

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PurposeThe purpose of this paper is to present a novel reflow profile optimization method using mechanical reliability estimation of micro‐ball grid array (μBGA) solder joints, based on the heating factor, Qη is introduced, where the coupling effect of reflow temperature and time on the mechanical reliability of μBGA joints is considered.Design/methodology/approachThe method presented is actualized through vibration fatigue tests. First, a two‐parameter Weibull distribution is used to model the collected data of vibration fatigue lifetime for different Qη. After that, two explicit functions are deduced in a unified mathematic expression form, which give an intuitionistic description of the mean time to failure and reliability of solder joints against induced variable Qη, thus revealing definitely the effect of Qη on the mechanical fatigue lifetime of solder joints suffering from cyclic vibration loading. Finally, for a specified reliability goal, how to choose proper Qη values, based an improved Golden Section Search arithmetic, is discussed.FindingsNumerical analysis and calculation are performed. The results show that the solder joints made at Qη near 510 have higher mechanical reliability, and those reflowed farther away this optimal value have less reliability.Originality/valueThis paper presents a useful and applicable solution to achieve reflow profile optimization and process control for a quantitative mechanical reliability estimation of μBGA solder joints.

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Multi-Physics Modelling for Microelectronics and Microsystems - Current Capabilities and Future Challenges

Cited by 5 publications

References 8 publications

Questionnaire-Based Discussion of Finite Element Multiphysics Simulation Software in Power Electronics

Questionnaire-Based Discussion of Finite Element Multiphysics Simulation Software in Power Electronics

Investigating the attack angle of squeegees with different geometries

Reflow profile optimization of μBGA solder joints considering reflow temperature and time coupling

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