Abstract:Conventional wire bonding in emerging wide bandgap (WBG) semiconductor devices employed in power modules is subjected to failure due to thermo-mechanical stress occurring at the joints. Pressure contact technology improves the reliability of such power modules, eliminating wire bonds between the substrate and components. This paper presents the characteristics and design process of a new type of spring connector in a gallium-nitride (GaN) DC-DC converter for reducing parasitics as well as improving heat dissip… Show more
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.