“…As a consequence, physical limits imposed by device packaging and cooling technology on peak power consumption and peak power density have made it impossible to power-on the entire chip at the same time, leading to the dark silicon problem [1]. In practice, to avoid high temperatures that would damage transistor junctures, a chip is generally constrained by a given Thermal Design Power (TDP), or recently by the more advanced Thermal Safe Power (TSP, [2]). In particular, they allow to activate only a subset of the processing cores at the nominal voltage/frequency level, i.e.…”