Multi-objective optimization for silicon wafer slicing using wire-EDM process

Dongre, Ganesh; Zaware, Sagar; Dabade, Uday A.; Joshi, Suhas S.

doi:10.1016/j.mssp.2015.06.050

Cited by 37 publications

(18 citation statements)

References 14 publications

(19 reference statements)

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“…A thin layer of thermal damage was observed on the wafer surface, and it was largely influenced by the exposure duration of plasma. The influence of controlled input parameters on the resultant thickness of the wafers and kerf-loss were analysed exclusively [13]. Researchers have also tried to propose a hybrid technique for wafer slicing which combines wire saw method and WEDM together.…”

Section: Introductionmentioning

confidence: 99%

Thin-wall micromachining of Ti–6Al–4V using micro-wire electrical discharge machining process

Singh

Ramkumar

2019

J Braz. Soc. Mech. Sci. Eng.

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Machining of delicate thin members having extremely small thickness as compared to the other two dimensions is a precarious task when performed using conventional fabrication techniques. Non-contact machining process, such as micro-wire electrical discharge machining (micro-WEDM) process, an advanced means of machining, offers an appropriate way to machine thin-wall structures in an utmost precise manner. In the present work, thin-wall micromachining of Ti-6Al-4V is performed while utilizing the contactless, negligible thermal damage, and deformation-free nature of micro-WEDM process energized through the resistance-capacitance generator. The objective is to explore the feasibility of a minimum possible wall thickness. Performing the thin-wall micromachining using wire step-over approach, it is established that a wall of average thickness 8.47 µm with an end deflection and a wall of thickness about 15 µm free from end deflection is possible to fabricate using micro-WEDM process. It achieves a high aspect ratio of 70 corresponding to the minimum thickness of the wall. What's more, a theoretical analysis is carried out to illustrate the functional relationship between wall-end deflection with workpieces' thermophysical properties, discharge parameters, and the geometric parameters of the wall. Finally, the comparative assessment of wall-end deflection and volumetric material removal rate attained with three different materials, namely Ti-6Al-4V, mild steel, and SS-304, reveal that thermophysical properties of workpiece material play a critical role in determining the wall-end deflection and the resultant volumetric material removal rate.

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Section: Introductionmentioning

confidence: 99%

Thin-wall micromachining of Ti–6Al–4V using micro-wire electrical discharge machining process

Singh

Ramkumar

2019

J Braz. Soc. Mech. Sci. Eng.

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“…However, the review presented in this paper is on current research trends carried out by various researchers studying the parametric influence on machining characteristics of WEDM process, machining advanced materials by using WEDM and modelling techniques in predicting the performance of WEDM process. WEDM process were developed in many areas, such as machining of advanced materials [15][16][17][18][19][20][21][22][23][24][25] and combining technology of grinding, milling, and turning with WEDM that benefits the virtue of both processes [3][4][5][6][8][9][10]. The topics are selected due to a growing need for machining advanced materials, novel techniques developed by using WEDM, and understanding the performance of WEDM (machining characteristics and modelling techniques).…”

Section: Spark Gapmentioning

confidence: 99%

“…However, increasing the wire tension led to machining instability. Dongree et al [17] proposed a hypothesis of by using WEDM process as an alternative for conventional methods for silicon wafer slicing. Gee et al [18] studied the variation in thickness of deterioration layer of monocrystalline silicon under different machining conditions.…”

Section: Wedm Of Advanced Materialsmentioning

confidence: 99%

“…Inference Rhoney et al [22] Truing of metal bonded diamond grinding wheel Badami et al [15] Fine pitch threads generated on superinvar material 40 TPI threads were produced Miller et al [21] Machining of porous metal foams, metal bonded diamond grinding wheel, sintered Nd-Fe-B magnets, and carbon-carbon bipolar plates Miller et al [21], [23][24][25] Machining of polished single crystal silicon (oil and water as dielectric medium); contouring of polished single crystal silicon plates Yu et al [71] Machining of poly-crystalline silicon using auxiliary pulse supply Lee et al [20] Machining of n-type high purity germanium (HP Ge) Yeh et al [72] Machining of polycrystalline silicon using phosphorous as dielectric medium Cheng et al [16] Generation of helical profiles on ultra-hard materials Gupta and Jain [75] Manufacture a miniature spur gear having total profile deviation of 13.20 µm, total lead deviation of 5.40 µm, and average surface roughness of 1.00 µm Greer et al [74] Parametric study on magnetic property of NdFeB permanent magnets material Hou et al [73] Parametric study on machining of zirconia Bae et al [76] Manufacture deep grooves of different depth to enhance super superior hydrophobic property Bobbili et al [77] Machinability of hot pressed boron carbide material Dongree et al [17] Silicon wafer slicing Gee et al [18], Gee et al [19] Studied the variation in thickness of deterioration layer of monocrystalline silicon Ayesta et al [80] Compared the fatigue life of WEDMed Inconel 718 material with that of ground specimen Joshi et al [82] Manufacture of ultra-thin silicon wafer with 140.5 m slicing size at the rate of 0.96 mm/min…”

Section: Referencesmentioning

confidence: 99%

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A progress review in wire electrical discharge machining process

Balan¹,

Giridharan²

2017

Int. J. Automot. Mech. Eng.

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Wire Electrical Discharge Machining (WEDM) is an electrothermal non-traditional machining process used for machining electrically conductive materials that are difficult to machine. Material removal in WEDM is by means of spark erosion. WEDM is proven to be the alternative for producing complex parts with higher degree of dimensional accuracy and better surface finish. Over the years, a significant amount of research was globally carried out to explore the WEDM process capability. This paper aims to explore the research work carried on parametric influence of WEDM process variables on various output performance measures. The paper also highlights various modelling techniques to predict optimal machining conditions and explore the feasibility of applying WEDM process to machine advanced materials. Combined technology that benefits from the virtues of WEDM and conventional method is also highlighted in this paper. The final section discusses the development and possible research trend in WEDM process.

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“…Experiments have been performed with four machining variables, pulse on time, pulse off time, spark voltage, peak current. Ganesh Dongre et al investigates the optimization of silicon wafer slicing by wire EDM process [31]. They deduced that work piece height, wire diameter, duty cycle and current are the control parameters of wafer slicing.…”

Section: Influence Of Electrical Process Parametersmentioning

confidence: 99%

Review of State of Art and Process Parameter Influence in EDM Technology

Abuthakeer¹,

Kaameswaran²,

chalam³

et al. 2017

IJETT

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Electric Discharge Machining (EDM) is a non-conventional machining process in which material is removed electrically by the application of a high voltage. Over the years the EDM process has cast itself into various specialized forms such as Wire cut EDM, EDM drilling etc. This paper presents a study of all the major improvements that have been implemented on EDM machining in the recent years. Various techniques proposed by researchers to improve the machining characteristics and to increase versatility of the EDM process have discussed in this paper. It should be noted that there is no well-defined relations between the electrical process parameters of an EDM process and the output variables like surface roughness, material removal rate etc. The influence of these material vary widely with material being machined. Hence, a study has been done on the influence of these parameters on the various process characteristics of EDM process.

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Multi-objective optimization for silicon wafer slicing using wire-EDM process

Cited by 37 publications

References 14 publications

Thin-wall micromachining of Ti–6Al–4V using micro-wire electrical discharge machining process

Thin-wall micromachining of Ti–6Al–4V using micro-wire electrical discharge machining process

A progress review in wire electrical discharge machining process

Review of State of Art and Process Parameter Influence in EDM Technology

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