Multi-layered SiC microchannel heat sinks - modeling and experiment

Skandakumaran, P.; Ortega, Alfonso; Jamaleddine, Tarek J.; Vaidyanathan, Ranji

doi:10.1109/itherm.2004.1319196

Cited by 11 publications

(6 citation statements)

References 8 publications

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“…The momentum and energy equations for the oneequation approach were solved both analytically and numerically, whereas the equations for the two-equation approach were solved numerically. Both models were compared to an extensive set of experimental data generated in the author's research group for copper-water minichannel heat sinks [16][17][18][19]. In general for the copper-water heat sinks, the experimental data agree well with the two-equation model but significantly diverge from the one-equation model.…”

Section: Discussionmentioning

confidence: 94%

“…(23) for the one equation model. The resulting code was used to produce simulations for the minichannel array studied by Ortega and co-workers [16][17][18][19], consisting of copper and silicon carbide heat sinks with multiple layers of square submillimeter channels, and water as a coolant. The results of the porous media simulations were compared to those of a three-dimensional thermal resistance network approach that was validated by Lei et al [16].…”

Section: Resultsmentioning

confidence: 99%

“…This type of stacked, multilayer, multichannel heat sink has been studied extensively in the author's research group [16][17][18][19] both experimentally and computationally. The combined results have been used to validate various modeling approaches, including a standard thermal resistance approach [16,17] and an approach that has proposed a modified effectiveness-number of transfer units (NTU) approach for modeling the behavior of mini-and microchannel heat sinks [20]. A broad conclusion from these studies is that conventional approaches that use existing laminar correlations for both Nusselt number and friction coefficient in rectangular and square channels are sufficiently accurate to capture the thermal-fluid behavior.…”

Section: Problem Descriptionmentioning

confidence: 99%

See 2 more Smart Citations

Analysis of Multilayer Mini- and Microchannel Heat Sinks in Single-Phase Flow Using One- and Two-Equation Porous Media Models

Hassell

Ortega

2011

Heat Transfer Engineering

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This article is devoted to an examination of the application of one-and two-equation porous media theory for modeling the thermal-fluid behavior of stacked multilayer micro-or minichannel heat sinks. The objectives of the article are to examine generalizations of the geometric scaling that is elucidated by adopting a porous media approach. This article examines the relative accuracy and computational efficiency of one-and two-equation approaches. The error between the two models and the experimental data is examined by an error map given as a function of conductivity ratios, Darcy number, and Reynolds number.

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Section: Discussionmentioning

confidence: 94%

Section: Resultsmentioning

confidence: 99%

Section: Problem Descriptionmentioning

confidence: 99%

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Analysis of Multilayer Mini- and Microchannel Heat Sinks in Single-Phase Flow Using One- and Two-Equation Porous Media Models

Hassell

Ortega

2011

Heat Transfer Engineering

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“…Wei and Joshi (2003) developed a simple thermal resistance network model to evaluate the overall thermal performance of a stacked micro-channel heat sink, and the aspect ratio, fin thickness and the ratio of channel width to fin thickness was optimized based on the model. Skandakumaran et al (2004) analyzed the thermal resistance of single and multi-layer micro-channel heat sinks with the thermal resistance network model. Chong et al (2002) modeled a single layer counter flow and a double layer counter flow microchannel heat sink with rectangular channels by employing the thermal resistance network., and the accuracy of the prediction was verified by comparing the results obtained with those from the more comprehensive three dimensional CFD conjugate heat transfer model, and good agreements were obtained.…”

Section: Introductionmentioning

confidence: 99%

Application of thermal resistance network model in optimization design of micro‐channel cooling heat sink

Shaoi

Wang

et al. 2009

International Journal of Numerical Methods for Heat &Amp; Fluid Flow

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Purpose -The purpose of this paper is to optimize the configuration sizes of micro-channel cooling heat sink using the thermal resistance network model. The optimized micro-channel heat sink is simulated by computational fluid dynamics method, and the total thermal resistance is calculated to compare with that of thermal resistance network model. Design/methodology/approach -Taking the thermal resistance and the pressure drop as goal functions, a multi-objective optimization model was proposed for the micro-channel cooling heat sink based on the thermal resistance net work model. The Sequential Quadratic Programming procedure was used to do the optimization design of the structure size of the micro-channel. The optimized micro-channel heat sink was numerically simulated by computational fluid dynamics (CFD) software. Findings -For the heat sink to cool a chip with the sizes of L Â W ¼ 2.5 mm Â 2.5 mm and the power of 8 W, the optimized width and height of the micro-channel are 154 lm and 1,000 lm, respectively, and its corresponding total thermal resistance is 8.255 K/W. According to the simulation results, the total thermal resistance of whole micro-channel heat sink R total is 7.596 K/W, which agrees well with the analysis result of thermal resistance network model. Research limitations/implications -The convection heat transfer coefficient is calculated approximatively here for convenience, and that may induce some errors. Originality/value -The maximum difference in temperature of the optimized micro-channel cooling heat sink is 59.064 K, which may satisfy the requirement for removal of high heat flux in new-generation chips.

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“…• Double layer counter flow micro-channel heat sink has less thermal resistance compared to parallel and counter flow single layer microchannel heat sink. [39] Analytical, numerical and experimental • The increase of the minichannel layers leads to reduce the thermal resistance and pumping power. • Analysis of the effect of individual geometric parameters in the performance of the heat sink and to find out its optimum parameters.…”

mentioning

confidence: 99%

Experimental and Numerical Thermal Analysis of Multi-Layered Microchannel Heat Sink for Concentrating Photovoltaic Application

et al. 2018

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Concentrating photovoltaic has a major challenge due to the high temperature raised during the process which reduces the efficiency of the solar cell. A multi-layered microchannel heat sink technique is considered more efficient in terms of heat removal and pumping power among many other cooling techniques. Thus, in the current work, multi-layered microchannel heat sink is used for concentrating photovoltaic cooling. The thermal behavior of the system is experimentally and numerically investigated. The results show that in extreme heating load of 30 W/cm2 with heat transfer fluid flow rate of 30 mL/min, increasing the number of layers from one to four reduces the heat source temperature from 88.55 to 73.57 °C. In addition, the single layered MLM heat sink suffers from the highest non-uniformity in the heat source temperature compared to the heat sinks with the higher number of layers. Additionally, the results show that increasing the number of layers from one to four reduces the pressure drop from 162.79 to 32.75 Pa.

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Multi-layered SiC microchannel heat sinks - modeling and experiment

Cited by 11 publications

References 8 publications

Analysis of Multilayer Mini- and Microchannel Heat Sinks in Single-Phase Flow Using One- and Two-Equation Porous Media Models

Analysis of Multilayer Mini- and Microchannel Heat Sinks in Single-Phase Flow Using One- and Two-Equation Porous Media Models

Application of thermal resistance network model in optimization design of micro‐channel cooling heat sink

Experimental and Numerical Thermal Analysis of Multi-Layered Microchannel Heat Sink for Concentrating Photovoltaic Application

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