We show that crack-free drilled structures with 25 µm hole size can be fabricated in the 12 µm-thick Permalloy foil by a nanosecond ultraviolet laser with low pulse energy and high repetition rate. The number of pulses required for drilling decreased with increasing pulse energy. The obtained hole exhibited a smaller size than the laser spot, implying that only the central part of a focused Gaussian beam contributed to the drilling. Debris and burr incurring as a result of the laser micromachining could be quickly removed by etching in an HCl/HNO 3 solution. This made it possible to obtain a clear structure without any debris remaining on the foil. This laserdirect process may be effectively utilized for fabricating fine metal masks necessary for the production of organic light emitting diode displays and other electronic devices.