Multi-layer spiral inductors in a high-precision, fully-planar MCM-D process

A Cochlea-based Preselector for UWB Applications

“…This technology offers high-Q suspended inductors and metal-insulator-metal (MIM) capacitors, along with three metal signal layers, a tantalum resistor layer, tungsten vias, and a 20 µm thick gold top metal layer (Fig. 3) [4].…”

On determining the characteristic impedance of low-loss transmission lines

“…The microstrip lines were fabricated in the multichip module deposited process described in [11] with construction details given in Table Figure 2 Transmission line discontinuity model. In the case of microstrip line, the lumped-element equivalent circuits at the ends of the transmission line represent the electrical discontinuity due to the step change in width between the microstrip line and the connecting stub from the probe pads.…”

“…Sections of coplanar waveguide (CPW) 3 mm in length were also fabricated in the same multichip module deposited process without a ground plane [11]. Substrate micromachining was applied in all cases to remove the silicon substrate, suspending the CPW structure on a bridge of SiO 2 dielectric.…”

Simulation of the contribution of magnetic films on planar inductors characteristics

“…Having localized losses, their annihilation is obtained by both reducing the coil resistance and thus choosing low-resistive and thick material for the metallic coil [1] and isolating the substrate from the metalization (reduction of eddy currents), hence choosing high-resistive semiconductor substrate or forming a cavity beneath the coil [2]. It is not easy to achieve a high-quality factor and the size reduction simultaneously.…”