Multi-Gb/s operation of flipped chip MVTL circuits

Dalrymple, B.J.; Leung, M.; Sandell, R.; Spargo, J.W.; Pham, Thi Dao; Spooner, A.

doi:10.1109/77.621794

Cited by 4 publications

(2 citation statements)

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“…Naturally, the chip interconnects represent a discontinuity in the interchip signal path. A variety of interconnecting techniques have been developed; a comparison in terms of their electrical properties is given in [5]. Among these techniques, the flip chip mounting allows the realization of low-inductance packaging.…”

Section: Transmission Of R S F Q Pulsesmentioning

confidence: 99%

“…Higher inductances increase the pulse rise times, cause reflections, and lead to higher crosstalk. For this reason, the flip chip approach was chosen as the parasitic inductances can be reduced significantly [5]. In order to prevent parasitic coupling to neighbouring signal lines, a coaxial via structure, which is known to provide better impedance match and low crosstalk [12], is c o n sidered.…”

Section: Flip-chip Interconnect For High Speed Applicationsmentioning

confidence: 99%

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Numerical studies of interchip pulse transmission for complex RSFQ systems

Toepfer

Lingel

Uhlmann

et al. 1999

IEEE Trans. Appl. Supercond.

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As the complexity of superconducting digital systems increases, the necessity of a careful design of interconnecting structures becomes more and more evident. Especially in the communication between chips, discontinuities are inevitable. Deriving a high frequency characterization of critical regions is therefore a crucial step for a design-oriented microwave modeling. We employed the Finite-Difference Time-Domain technique based on the discretization of Maxwell's equations for the numerical analysis of typical interconnect components, e.g. flip chip connection pads, vias, and transmission line discontinuities. The peculiar properties of superconductors are taken into account by incorporation of the London equations and the two-fluid model into the numerical scheme. Computer simulations have been carried out for various arrangements. Their results show in the timedomain how the shape of an Rapid Single Flux Quantum (RSFQ) pulse is affected by passing a discontinuity in the interchip signal path. Furthermore, frequency domain characterizations are obtained in terms of scattering parameters providing information about the bandwidth of the structure under investigation.

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Section: Transmission Of R S F Q Pulsesmentioning

confidence: 99%

Section: Flip-chip Interconnect For High Speed Applicationsmentioning

confidence: 99%