Multi-functional epoxy/SrTiO/sub 3/ ceramic powder embedded capacitor films(ECFs) for organic substrates

Lee, Sang-Yong; Hyun, Jin-Gul; Chung, Chang Hee; Paik, Kyung‐Wook

doi:10.1109/eptc.2006.342772

Cited by 2 publications

(2 citation statements)

References 8 publications

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“…Motorola reported that a capacitance tolerance of ±21% (7% standard deviation in the worst cases) can be achieved for CFP capacitors with a mezzanine micro via contact (Croswell R. et al, 2002). When ferroelectric materials such as BaTiO 3 are used in the capacitor dielectric layer, the capacitor commonly exhibits a large temperature drift in the order of several hundreds of ppm in capacitance (Kawasaki M. et al, 2004;Popielarz R. et al, 2001;Kuo D. H. et al, 2001; Lee S. et al, 2006) and a loss tangent as large as 1-5%. It is difficult to obtain a resulting Q factor of the capacitors above 30 at the GHz frequency band.…”

Section: Materials Classes Ceramic-filled Resin Ceramicmentioning

confidence: 99%

“…Although laminate-based film capacitors can provide similar or bigger capacitance densities compared to LTCC by introducing ferroelectric materials, they exhibit a large temperature coefficient of capacitance (TCC). The reason is that the ferroelectric ceramics used in film capacitors, such as BaTiO 3 , SrTiO 3 show large changes in their dielectric constant around the phase transition temperatures (Kawasaki M. et al, 2004;Popielarz R. et al, 2001;Kuo D. H. et al, 2001; Lee S. et al, 2006). Moreover, polymer materials such as epoxy usually have a large change in dielectric constant around the glass transition temperature (Tg).…”

Section: Comparison Among Laminate Ltcc and Thin Film Based Approachesmentioning

confidence: 99%

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Advanced Microwave Circuits and Systems

Zhurbenko

2010

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Section: Materials Classes Ceramic-filled Resin Ceramicmentioning

confidence: 99%

Section: Comparison Among Laminate Ltcc and Thin Film Based Approachesmentioning

confidence: 99%

Advanced Microwave Circuits and Systems

Zhurbenko

2010

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Integrated Passives for High-Frequency Applications

Mi¹,

Ueda²

2010

Advanced Microwave Circuits and Systems

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Introduction 1.1 Definitions of Integrated Passives Passive elements are indispensable in RF systems and are used for matching networks, LC tank circuits, attenuators, filtering, decoupling purposes and so on (Tilmans H. A C et al., 2003). Passive elements can be simply classified into distributed elements including transmission lines and waveguides, and lumped elements including inductors, capacitors and resistors. The distributed circuits take into account the phase shift occurring when the signal wave propagates along the circuits. As the operating frequency moves into the microwave spectrum, the distributed circuits have a higher Q factor, and thus they are usually used for high-frequency applications. Lumped elements are zero-dimensional by definition. In other words, the lumped elements have no physical dimensions which are significant with respect to the wavelength at the operating frequency, so that the phase shift that arises can be ignored. Discrete lumped elements are conventionally used in electronic circuits that work at a lower frequency. This is because the sizes of the discrete lumped elements become comparable to the wavelength at microwave frequencies. With the advent of new photolithography and passive integration technologies, the three basic building blocks for circuit design-inductors, capacitors, and resistors can be made small enough to be available in lumped form (Tummala R. R. et al., 2000). Lumped passive components may be discrete, integrated or embedded. The discrete is a singular device in a leaded or surface mount technology (SMT) case. This includes screen-printed resistors, capacitors, and inductors. Passive integration technologies allow several passive components to be integrated, either into a substrate (embedded) or onto a substrate (integrated). Integrated passive devices usually come in a compact SMT package or chipscale package (CSP) as a stand-alone component with input, output and ground terminations, which is much smaller than the operating wavelength providing some complete circuit functions, such as impedance-matching, filtering and so on, for highfrequency applications up to several tens of GHz (Tilmans H. A C et al., 2003). The lumped element circuits have the advantage of a smaller size, lower cost, and wide-band characteristics, though the Q factor is generally lower than distributed circuits. Integrated lumped passive circuits with a small form factor are especially suitable for some RF and microwave applications where real estate or wide-band requirements are of prime importance, for example mobile phones or other handheld wireless products. The choice 13 www.intechopen.com

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Multi-functional epoxy/SrTiO/sub 3/ ceramic powder embedded capacitor films(ECFs) for organic substrates

Cited by 2 publications

References 8 publications

Advanced Microwave Circuits and Systems

Advanced Microwave Circuits and Systems

Integrated Passives for High-Frequency Applications

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