Multi-die packaging and thermal superposition modeling

Kelly, Mike; Fosnot, Phillip; Wei, Jonathan; Min, Max; Galloway, Jesse

doi:10.1109/semi-therm.2018.8357348

Cited by 2 publications

(3 citation statements)

References 3 publications

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“…First, high- performance chips are laterally placed close to each other while their temperature-sensitivity and mechanical-reliability metrics are different. This is a common scenario in 2.5D package platforms [28,46,79,[82][83][84][85][86][87][88][89][90][91][92][93]. Second, high-performance chips are vertically stacked, while the thermal resistance increases with the number of stacked chips.…”

Section: Thermal Management Challenges In Heterogeneousmentioning

confidence: 99%

“…This requires effective cooling very close to the heat source. However, some of the 2.5D packages have various layers, such as TIM and heat slug layers, between the heat source and the heat sink for reliability concerns at the board level [83,85,89,92]. When the heat sink has a rough contact surface and the 2.5D package has a large thermally induced or assembly warpage, the possibility of the active device cracking and failure increases after the heat sink is attached.…”

Section: Thermal Management Challenges Due To Multichipmentioning

confidence: 99%

“…3.1.2 Thermal Crosstalk. In advanced heterogeneous packages, heat generation in each device can affect neighboring units [28,46,78,81,83,107]. In the 2.5D package platform, the logic device and HBMs are placed within 500 lm because of signal integrity/power integrity (SI/PI) performance.…”

Section: Thermal Management Challenges Due To Multichipmentioning

confidence: 99%

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Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Kim

Ren

Yuksel³

et al. 2020

Journal of Electronic Packaging

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Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects are important, as trends of electronics packaging toward higher power, higher density, and 2.5D/3D integration are making thermal management even more challenging. While conventional cooling solutions based on large thermal-conductivity materials as well as heat pipes and heat exchangers may dissipate the heat from a source to a sink in a uniform manner, thermal metamaterials could help dissipate the heat in a deterministic manner and avoid thermal crosstalk and local hot spots. This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated packaging challenges, this paper also discusses the implications of thermal metamaterials for the future of electronic packaging thermal management. Thermal metamaterials could provide a solution to nontrivial thermal management challenges. Future research will need to take on the new challenges in implementing the thermal metamaterial designs in high-performance heterogeneous packages to continue to advance the state-of-the-art in electronics packaging.

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