2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00345
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Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications

Vasarla Nagendra Sekhar,
Mishra Dileep Kumar,
Sasi Kumar Tippabhotla
et al.
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