Abstract:The wafer manufacturing industry has increased pattern complexity of the main feature and sub-resolution assist feature (SRAF) required for improving the EUV lithography process window and enabling the leading-edge technology nodes. In parallel, Inverse Lithography Technology (ILT) and its requirements of curvilinear data structure has gained momentum in recent years, putting the pressure on mask makers, in particular the mask writer. To fulfill the curvilinear feature requirements of high pattern resolution a… Show more
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