Multi-Angle Plasma Focused Ion Beam (FIB) Curtaining Artifact Correction Using a Fourier-Based Linear Optimization Model

Abstract

We present a flexible linear optimization model for correcting multi-angle curtaining effects in plasma focused ion beam scanning electron microscopy (PFIB-SEM) images produced by rocking-polishing schemes. When PFIB-SEM is employed in a serial sectioning tomography workow, it is capable of imaging large three-dimensional volumes quickly, providing rich information in the critical 10–100 nm feature length scale. During tomogram acquisition, a “rocking polish” is often used to reduce straight-line “curtaining” gradations in the milled sample surface. While this mitigation scheme is effective for deep curtains, it leaves shallower line artifacts at two discretized angles. Segmentation and other automated processing of the image set requires that these artifacts be corrected for accurate microstructural quantification. Our work details a new Fourier-based linear optimization model for correcting curtaining artifacts by targeting curtains at two discrete angles. We demonstrate its capabilities by processing images from a tomogram from a multiphase, heterogeneous concrete sample. We present methods for selecting the parameters which meet the user’s goals most appropriately. Compared to previous works, we show that our model provides effective multi-angle curtain correction without introducing artifacts into the image, modifying non-curtain structures or causing changes to the contrast of voids. Our algorithm can be easily parallelized to take advantage of multi-core hardware.

Advanced characterisation of 3D structure and porosity of ordinary portland cement (OPC) mortar using plasma focused ion beam tomography and X‐ray computed tomography

“…This is in part due to the variation of their hardness and thus differing milling/sputtering rates 36,37 . The most common image artefact is curtaining that makes following data analysis quite difficult 38 . The success of pore and structure characterisation depends strongly on sample preparation 23,39 .…”

Designing Angstrom‐Scale Asymmetric MOF‐on‐MOF Cavities for High Monovalent Ion Selectivity

“…Furthermore, the striations seen in the UiO‐66‐NH 2 (PSS)/ZIF‐8(PVP) film in Figure 2B,2C are due to artifacts from FIB in the preparation of the cross‐section sample for TEM. [ 27 ]…”

“…Furthermore, the striations seen in the UiO-66-NH 2 (PSS)/ZIF-8(PVP) film in Figure 2B,2C are due to artifacts from FIB in the preparation of the cross-section sample for TEM. [27] The membrane constructed by this process consists of a UiO-66-NH 2 (PSS) layer with thickness estimated to be 125 ± 15 nm and a ZIF-8(PVP) layer with a thickness of 571 ± 18 nm, collectively forming a thin structure that resembles bio-inspired asymmetrical gateways. As mentioned previously, two other membranes with asymmetrical nanochannels were also prepared as benchmarks.…”

The Trends of In Situ Focused Ion Beam Technology: Toward Preparing Transmission Electron Microscopy Lamella and Devices at the Atomic Scale

“…However, the 3D structure and small size of FinFETs make the curtain artifacts of the FinFET TEM sample more obvious, which seri ously affects the quality of the TEM samples. [73][74][75] To solve this problem, Denisyuk et al proposed a special sample preparation step for FinFETmultiple tilting samples during thinning. [73,76] The curtain effect of the sample is minimized to improve the sample quality.…”