2005
DOI: 10.1179/174329405x40948
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Motion planning for coating process optimisation in electron beam physical vapour deposition

Abstract: Electron beam physical vapour deposition (EB-PVD) is used mainly in a variety of coating and surface engineering applications. The present research focuses on coating process optimisation using EB-PVD for turbine blades, which are widely used in industrial, marine and aircraft applications. More specifically, the present research identifies the five most important objectives for the EB-PVD coating process and then proposes metrics to quantify such objectives. In addition, a heuristic for EFB-PVD process optimi… Show more

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Cited by 5 publications
(4 citation statements)
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References 27 publications
(34 reference statements)
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“…Even though the vapor travels in straight lines, high-vacuum (low pressure) physical vapor deposition techniques such as electron beam-physical vapor deposition (EB-PVD) 20 can deposit coatings on many complex substrate shapes by careful optimization of substrate manipulation and source material emission rate. [21][22][23] However, substrates with interior surfaces, such as doublet guide vanes used to control gas flow in gas turbine engines, 24,25 contain regions that are hidden from sight of the vapor source for all substrate orientations. In order for vapor molecules to access these hidden regions during PVD, the mean free path (MFP) between gas molecule collisions must be smaller than the length of the opening to the inner substrate surfaces.…”
Section: Introductionmentioning
confidence: 99%
“…Even though the vapor travels in straight lines, high-vacuum (low pressure) physical vapor deposition techniques such as electron beam-physical vapor deposition (EB-PVD) 20 can deposit coatings on many complex substrate shapes by careful optimization of substrate manipulation and source material emission rate. [21][22][23] However, substrates with interior surfaces, such as doublet guide vanes used to control gas flow in gas turbine engines, 24,25 contain regions that are hidden from sight of the vapor source for all substrate orientations. In order for vapor molecules to access these hidden regions during PVD, the mean free path (MFP) between gas molecule collisions must be smaller than the length of the opening to the inner substrate surfaces.…”
Section: Introductionmentioning
confidence: 99%
“…The cosine law of emission and related models has been used to predict the deposition thickness of simple planar substrates (Glang, 1976;Graper, 1973;Hill, 1986;Fancey and Matthews, 1993;James et al, 1995). Recently, a computational model for controlling thickness for workpieces with complex geometry such as turbine blades using finite-element techniques and a ray tracing algorithm has been developed (Cho et al, 2005). This computational model is generic and can be used for predicting deposition thickness on complex workpieces, for example, a jet nozzle and thruster.…”
Section: Multilayered Rhenium Coatingmentioning
confidence: 99%
“…However, it can provide significant improvement for the computation by reducing the number of states. The algorithm for generating motion plans to improve uniformity of the layer deposition based on the look-ahead approach has been developed (Cho et al, 2005). Although it has been demonstrated in this literature that the algorithm has focused on improving only uniformity, it can also be used for improving any objective in the same way.…”
Section: Motion Planning For Performance Improvementmentioning
confidence: 99%
“…Several deposition techniques are used to deposit thin (<1 μm) and thick (>1 μm) copper films. Physicalvapour-deposition (PVD) processes [17][18][19][20], like sputtering [21][22][23][24][25] and electron beam evaporation [26][27][28][29], Chemical-vapour-deposition (CVD) [30][31][32][33][34], atomic layer deposition (ALD) [35][36][37][38] methods are used to deposit high-quality, defect-free, continuous films; however, the average thickness of deposited films is generally less than 1 μm. Electroplating is used in those applications where the thick blanket film is required or blind/through holes must be filled.…”
Section: Introductionmentioning
confidence: 99%