2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) 2013
DOI: 10.1109/apec.2013.6520206
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MOSFET gate open failure analysis in power electronics

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Cited by 13 publications
(4 citation statements)
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“…Furthermore, continued narrow overvoltage spikes between collector and emitter may open the gate-emitter resistance resulting of a loss in the driving signal and misfiring of the IGBT [16]. This can result in thermal breakdown [17]. Also, as modern IGBTs can work at much higher temperatures than the gate drive circuit components the driver circuit could suffer from the thermal effects in such a scenario.…”
Section: A Converter Failure Mechanismsmentioning
confidence: 99%
“…Furthermore, continued narrow overvoltage spikes between collector and emitter may open the gate-emitter resistance resulting of a loss in the driving signal and misfiring of the IGBT [16]. This can result in thermal breakdown [17]. Also, as modern IGBTs can work at much higher temperatures than the gate drive circuit components the driver circuit could suffer from the thermal effects in such a scenario.…”
Section: A Converter Failure Mechanismsmentioning
confidence: 99%
“…Continued narrow overvoltage spikes between collector and emitter may open the gate-emitter resistance, while over-current of IGBT's collector may lead to gate-emitter resistance degradation [16]. Gate open-circuit failure can result in thermal runaway or high power dissipation [17]; however detailed research on the physical failure mechanism is still lacking. Moreover, modern IGBTs can work at 175°C junction temperature, which means the case temperature could reach 100°C or more, while most components in the driver cannot work normally at such high temperature.…”
Section: A Open-circuit Failure Mechanismsmentioning
confidence: 99%
“…The consequent number of converters required, when LVDC networks are combined with high numbers of EVs, further increases the pressure to improve converter efficiency as losses from thousands of converters accumulate, and underlines the imperative to meet strict harmonic standards to ensure continued grid stability [9–11]. To date, higher power applications have been met using two‐level insulated‐gate bipolar transistor (IGBT) inverters, however IGBT devices are now at the limit of performance.…”
Section: Introductionmentioning
confidence: 99%