Morphology and distribution of subsurface damage in optical fused silica parts: Bound-abrasive grinding

Li, Yaguo; Zheng, Nan; Li, Haibo; Hou, Jing; Lei, Xiangyang; Chen, Xianhua; Yuan, Zhijun; Guo, Zhaozhou; Wang, Jian; Guo, Yinbiao; Xu, Qiao

doi:10.1016/j.apsusc.2010.09.051

Cited by 86 publications

(28 citation statements)

References 26 publications

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“…The depth of the SSD created by the grinding is minimized when the feed velocity (V f ) and the depth of cut (ap) are minimized and when the spindle speed (V c ) is maximized. This result is in partial agreement with results found by Li et al [10] and Esmaeilzare et al [8] for rough grinding of fused silica and Zerodur glass respectively. Li et al established the same influence for the depth of cut in SSD but no evidence of spindle speed and feed rate influences, but they used a different grinding mode.…”

Section: Influence Of Process Parameters On Ssd Depthsupporting

confidence: 93%

“…Material studied Grinding type Abrasive Grinding mode Influence on SSD Agarwal et al [6] SiC Rough Bound b ap ⇒ SSD Perveen et al [7] BK7 glass Micro Bound b ap ⇒ SSD Esmaeilzare et al [8] Zerodur glass Rough Bound b Vc ⇒ SSD Maksond et al [9] Si3N4 Rough Bound c ap ⇒ SSD Li et al [10] Fused silica Rough to finish Bound c ap ⇒ SSD Pei et al [5] Si wafers Fine Bound a Vc, f no influence Wang et al [11] BK7 glass Polishing Loose a Ca ⇒ SSD Zhang et al [12] Nd doped phosphate glass Polishing Loose a Vc ⇒ SSD Neauport et al [13] Fused silica Polishing Loose a Vc, Ca, P ⇒ SSD…”

Section: Authorsmentioning

confidence: 98%

“…1(c)) the feed direction is parallel to the workpiece plane but the grinding wheel rotation plane is perpendicular to that plane. In such a configuration, Maksoud et al (for Si 3 N 4 grinding) and Li et al (for rough to finish grinding of fused silica) found that SSD depth increases when the depth of cut increases, but they saw no influence of the grinding wheel speed and the feed rate [9,10].…”

Section: Introductionmentioning

confidence: 95%

See 2 more Smart Citations

Subsurface mechanical damage during bound abrasive grinding of fused silica glass

Blaineau

Debenath

Laheurte

et al. 2015

Applied Surface Science

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Section: Influence Of Process Parameters On Ssd Depthsupporting

confidence: 93%

Section: Authorsmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 95%

See 1 more Smart Citation

Subsurface mechanical damage during bound abrasive grinding of fused silica glass

Blaineau

Debenath

Laheurte

et al. 2015

Applied Surface Science

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“…When the lateral cracks intersect with the surface, the material will be removed as chips and SSD can be formed. The radical cracks can reach much farther below the surface and thereby form SSD [16][17][18][19]. During the grinding process of all the samples, the feed rate was kept constant as 600 rpm, but the other grinding parameters, such as average abrasive size, grinding force, wheel speed, and grinding depth, were adjusted intentionally, as shown in Table 2.…”

Section: Grinding Samplesmentioning

confidence: 99%

Relationship between grinding process and the parameters of subsurface damage based on the image processing

Wang

Hong-feng

et al. 2015

Int J Adv Manuf Technol

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Grinding is the main process step for the highprecision optical components, and its process parameters may bring forth subsurface damage to some degrees on the surfaces and finally result in the variation of the mechanical and optical properties of the components. In this paper, the ground sample is etched to expose the micro cracks and the characterization parameters of the subsurface damage are extracted using the image processing method. To investigate the influence of main grinding parameters on the micro cracks of subsurface damage, relationships among the average abrasive size, grinding force, wheel speed, and grinding depth and characterization parameters (length, angle, and density) of micro cracks are established. The results show that the influence of grinding parameters on the micro crack's length is consistent with that on the surface roughness. The average abrasive size and grinding force have obvious influence on the subsurface damage and surface roughness than wheel speed and grinding depth. Micro cracks' angle and density are almost not affected by the grinding parameters.

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“…Simple investigations of SSD by MRF technique are limited to the determination of the maximum crack depth [10,11]. Miller et al first analyzed the depth profile of the crack density by single micrographs along the wedge [4].…”

Section: Introductionmentioning

confidence: 99%

Influence of Cutting Speed on Subsurface Damage Morphology and Distribution in Ground Fused Silica

2017

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Abstract:In optical fabrication, brittle-hard materials are used for numerous applications. Especially for high-performance optics for laser or lithography applications, a complex and consistent production chain is necessary to account for the material properties. Particularly in pre-processing, e.g., for shaping optical components, brittle material behavior is dominant which leads to a rough surface layer with cracks that reach far below the surface. This so called subsurface damage (SSD) needs to be removed in subsequent processes like polishing. Therefore, it is essential to know the extent of the SSD induced by shaping for an efficient design of precise corrective processes and for process improvement. Within this work the influence of cutting speed on SSD, in fused silica, induced by grinding has been investigated. To analyze the subsurface crack distribution and the maximum crack depth magnetorheological finishing has been appointed to polish a wedge into the ground surface. The depth profile of SSD was analyzed by image processing. For this purpose a coherent area of the polished wedge has been recorded by stitching microscopy. Taking the form deviation of the ground surface in to account to determine the actual depth beneath surface, the accuracy of the SSD-evaluation could be improved significantly. The experiments reveal a clear influence of the cutting speed on SSD, higher cutting speeds generate less SSD. Besides the influence on the maximum crack depth an influence on the crack length itself could be verified. Based on image analysis it was possible, to predict the maximum depth of cracks by means of crack length.

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Morphology and distribution of subsurface damage in optical fused silica parts: Bound-abrasive grinding

Cited by 86 publications

References 26 publications

Subsurface mechanical damage during bound abrasive grinding of fused silica glass

Subsurface mechanical damage during bound abrasive grinding of fused silica glass

Relationship between grinding process and the parameters of subsurface damage based on the image processing

Influence of Cutting Speed on Subsurface Damage Morphology and Distribution in Ground Fused Silica

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