More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode

Ly, Nhat; Xu, Di; Song, Wenjing; Mayer, Michael

doi:10.1016/j.microrel.2014.10.004

Cited by 14 publications

(14 citation statements)

References 17 publications

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“…After analysis, some scholars believe that the distribution of Pd is related to the position of EFO discharge electrode, and the energy generated by different positions of EFO discharge electrode is different in the distribution of FAB, which leads to the difference in Pd distribution. Ly et al [ 42 ] used PdCu wire with a purity of 4 N (99.99 wt. %) and a diameter of 20 μm (the thickness of Pd layer is approximately 70–90 nm) to study the distribution of Pd by fixed electrode and movable electrode ( Figure 11 ) and set high and low EFO discharge current.…”

Section: The Distribution Of Pd In Fab and Bonding Interfacementioning

confidence: 99%

Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Zhang,

Guo,

Cao

et al. 2023

Micromachines

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Wire-bonding technology is the most commonly used chip interconnection technology in microelectronic packaging. Metal bonding wire is the key material for wire bonding and plays an important role in the reliability of electronic devices. In recent years, palladium-plated copper (PdCu) bonding wire has been widely used because of its low cost, good electrical and thermal conductivity, the fact that it is not easy to oxidize, and its high reliability. Therefore, it is necessary to review its research progress. In this paper, the preparation and application of palladium-plated copper bonding wire are reviewed. Firstly, the preparation methods of electroplating, electroless plating, and direct plating are introduced. Secondly, the factors affecting the distribution of Pd in free air balls and bonding interfaces, the effect of Pd on the formation and growth of intermetallic compounds in PdCu wire, stitch bond, and reliability of PdCu wire are summarized and analyzed in the application process. Finally, its development prospect is prospected. Hopefully, this review can help readers to have a comprehensive understanding of the preparation and application of palladium-plated copper bonding wires, and can accelerate the promotion of its application in more fields in the future.

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Section: The Distribution Of Pd In Fab and Bonding Interfacementioning

confidence: 99%

Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Zhang,

Guo,

Cao

et al. 2023

Micromachines

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“…Currently, the alternative materials with the most potential are copper-based and silver-based wires [ 7 , 8 , 9 , 10 ]. The most attention has been paid to palladium-coated copper wire [ 11 , 12 ]. Pure copper wires easily oxidize and corrode, causing reliability concerns.…”

Section: Introductionmentioning

confidence: 99%

“…Silver-based wires are mainly used in the form of silver alloy [ 13 , 14 ] and gold-coated silver wires [ 15 , 16 ]. According to research [ 11 , 17 , 18 ], adding palladium to silver-based wires results in a palladium-rich single-phase layer at the bonding interface, which can inhibit the formation of intermetallic compounds (IMCs). In addition, adding gold and palladium simultaneously helps improve the electromigration effect and increases the life cycle of silver-based wires.…”

Section: Introductionmentioning

confidence: 99%

Metallographic Mechanism of Embrittlement of 15 μm Ultrafine Quaternary Silver Alloy Bonding Wire in Chloride Ions Environment

2023

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Chloride ions contained in the sealing compound currently used in the electronic packaging industry not only interact with intermetallic compounds but also have a serious impact on silver alloy wires. A 15 μm ultrafine quaternary silver-palladium-gold-platinum alloy wire was used in this study. The wire and its bonding were immersed in a 60 °C saturated sodium chloride solution (chlorination experiment), and the strength and elongation before and after chlorination were measured. Finally, the fracture surface and cross-section characteristics were observed using a scanning electron microscope and focused ion microscope. The results revealed that chloride ions invade the wire along the grain boundary, and chlorides have been generated inside the cracks to weaken the strength and elongation of the wire. In addition, chloride ions invade the interface of the wire bonding to erode the aluminum substrate after immersing it for enough long time, causing galvanic corrosion, which in turn causes the bonding joint to separate from the aluminum substrate.

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“…Bonding is one of the key technologies in microelectronics [ 1 ]. As the key tool in wire bonding, the geometric parameters of the ceramic capillary determines the quality and reliability of the chip packaging.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ceramic Capillary Parameters on Bonded Morphology and Strength

et al. 2020

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The effects of the geometry parameters of a ceramic cleaver on the morphology of ball and second bonded points were studied using an automatic wire bonder, push pull tester, scanning electron microscope, ceramic capillary with different geometric parameters and φ25.4 μmAg-5Au bonding alloy wire, etc. The result shows that when the inner hole diameter (IHD) of the ceramic capillary is 1.3 times the diameter of the alloy wire (33 μm), the neck morphology of the ball bonded point (first bonded point) meet the requirements. The neck of the ball bonded point appeared to fracture when the IHD is 26 μm; The neck of the ball bonded point appeared as an irregular shape when the IHD is 41 μm. When the inner cutting angle diameter (ICAD) is 64 μm, the size of the mashed ball diameter (MBD) is qualified. When the ICAD is 51 μm, the MBD is too large and mashed ball overflows the pad. When the ICAD is 76 μm, the ball bonded point is too high. When the inner cutting bevel angle (ICBA) is 100°, the MBD size meets the requirements of the pad. When the ICBA was reduced to 70°, the ball bonded point is eccentric. When the ICBA was increased to 120°, the MBD is too large and is connected to the adjacent pad contact. The size of the fish tail of the second bonded point (second bonded point) changed in the same direction as the tip diameter (TD) changes. When the TD is 178 μm, the fish tail shape is regular and symmetrical. When the working face angle (WFA) is 8° and the outer circular radius (OCR) is equal to the diameter of the alloy wire (25.4 μm), the fish tail shape is regular. When the WFA is higher than 11° or the OCR is higher than 30 μm, the fish tail will appear as virtual welding, and when the WFA is less than 4°, the fish tail of the second bonded point will break due to thinning. When the OCR is less than 20 μm, the fish tail of the second bonded point is too long and causes a short circuit.

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More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode

Cited by 14 publications

References 17 publications

Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Metallographic Mechanism of Embrittlement of 15 μm Ultrafine Quaternary Silver Alloy Bonding Wire in Chloride Ions Environment

Effect of Ceramic Capillary Parameters on Bonded Morphology and Strength

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