2009
DOI: 10.1007/978-0-387-75593-9
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More than Moore

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Cited by 27 publications
(1 citation statement)
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References 62 publications
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“…This trend along Moore’s Law [11] is powered by advancements in complementary metal oxide semiconductor (CMOS) fabrication. More recently, there has been a drive to integrate more devices on a single chip; this means the integration of more than just transistors, but also multiple applications, such as sensors or radio frequency (RF) circuits, labeled as the More-than-Moore approach [12,13]. The first attempts at integration of multiple functionalities were on the package level and this in-package integration dealt with connecting multiple dies with bond wires and packaging them together.…”
Section: Introductionmentioning
confidence: 99%
“…This trend along Moore’s Law [11] is powered by advancements in complementary metal oxide semiconductor (CMOS) fabrication. More recently, there has been a drive to integrate more devices on a single chip; this means the integration of more than just transistors, but also multiple applications, such as sensors or radio frequency (RF) circuits, labeled as the More-than-Moore approach [12,13]. The first attempts at integration of multiple functionalities were on the package level and this in-package integration dealt with connecting multiple dies with bond wires and packaging them together.…”
Section: Introductionmentioning
confidence: 99%