Monte Carlo modeling of the extraction of roughness parameters at nanometer scale by Critical Dimension Scanning Electron Microscopy

Ciappa, Mauro; Ilgünsatiroglu, Emre; Illarionov, A. Yu.; Filosomi, F.; Santini, Cristina Costa

doi:10.1109/essderc.2014.6948834

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Simulation and CD Extraction1

Fig 5 Assembly Tolerance Analysis By Monte Carlo Simulation1

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Cited by 2 publications

(3 citation statements)

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“…Because of the relevant implications for SEM-based metrology, this issue deserves a deeper investigation. A quantitative study of this aspect is presented in [10]. …”

Section: Discussionmentioning

confidence: 99%

See 1 more Smart Citation

Exploring the limits of scanning electron microscopy for the metrology of critical dimensions of photoresist structures in the nanometer range

Ciappa

Ilgünsatiroglu

Illarionov

2014

Microelectronics Reliability

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“…Because of the relevant implications for SEM-based metrology, this issue deserves a deeper investigation. A quantitative study of this aspect is presented in [10]. …”

Section: Discussionmentioning

confidence: 99%

“…This fact has a great impact on the quantitative extraction of the line roughness parameters by SEM. This relevant issue is investigated quantitatively in [10]. The bottom width along the central line as extracted by CA is shown in Fig.…”

Section: Simulation and CD Extractionmentioning

confidence: 99%

Exploring the limits of scanning electron microscopy for the metrology of critical dimensions of photoresist structures in the nanometer range

Ciappa

Ilgünsatiroglu

Illarionov

2014

Microelectronics Reliability

View full text Add to dashboard Cite

“…Monte Carlo simulations have been widely used in the reliability assessment of power electronics systems [10]. The method also finds its use in optical interconnect system under various fabrication and assembly errors [11] and even in addressing main challenges for the metrology of critical dimensions in nanostructures [12]. As we can observed, there are several industry applications of Monte Carlo such as analyzing the effects of geometric deviations on t performance of magnetic gears [13].…”

Section: Fig 5 Assembly Tolerance Analysis By Monte Carlo Simulationmentioning

confidence: 99%

Automotive Package Lead Pullback Elimination Using Monte Carlo Analysis for Determining Leadframe and Blade Design

Talledo¹,

Cabading²,

Real³

2021

JERR

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This study focuses on eliminating the lead pullback problem in an automotive quad flat no lead (QFN) package in order to meet the non-negotiable requirement to have a solder wettable or solderable lead sidewall. It involves using a non-traditional approach of Monte Carlo tolerance analysis to determine the final leadframe and singulation blade design solution. It was found out that the zero lead pullback could be achieved by reducing the leadframe lead to lead distance from 0.275 mm to 0.225 mm and increasing the blade thickness from 0.325 mm to 0.350 mm. Actual results from 10 line stressing lots all showed zero pullback validating the effectiveness of the final design and the use of Monte Carlo tolerance analysis technique. Costly investment for a lead pullback inspection system was avoided and the 100% manual inspection eliminated.

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Monte Carlo modeling of the extraction of roughness parameters at nanometer scale by Critical Dimension Scanning Electron Microscopy

Cited by 2 publications

References 4 publications

Exploring the limits of scanning electron microscopy for the metrology of critical dimensions of photoresist structures in the nanometer range

Exploring the limits of scanning electron microscopy for the metrology of critical dimensions of photoresist structures in the nanometer range

Automotive Package Lead Pullback Elimination Using Monte Carlo Analysis for Determining Leadframe and Blade Design

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