Monolithic interconnected modules (MIM) for high irradiance photovoltaic energy conversion: A comprehensive review

Comprehensive electrical loss analysis of monolithic interconnected multi‐segment laser power converters

“…The photoactive and supporting layers of MIM devices, including a thick and highly doped lateral conduction layer (LCL) that provides a low ohmic path for a lateral current flow below the segments, are usually grown with an epitaxial process on an inactive semi‐insulating (S.I.) substrate that provides electrical separation of the individual PV cell segments in the finished device . After the epitaxial growth, a first etching step down to the LCL opens the regions where internal electrodes of the individual segments will be contacted and a second etching step into the substrate forms isolation trenches that provide electrical separation of adjacent PV segments.…”

“…A monolithic interconnected module (MIM) technology enables to manufacture miniaturized photovoltaic (PV) modules on chip level . In such devices, an elevated output voltage on a device level is achieved by a series connection of many electrically separated PV cell segments using standard microelectronic fabrication processing methods .…”

“…The broad range of applications leads to a variety of geometries (pie‐shaped circular, parallel stripes, …materials [GaAs, InGaAs, Si, …]) and monolithic interconnection schemes for MIMs . This diversity presents a challenge to establish simulation methods to accurately model and simulate such devices.…”

“…KEYWORDS electrical modeling, laser power converter, lateral conduction layer, monolithic interconnected module, perimeter recombination, photo-induced shunt 1 | INTRODUCTION A monolithic interconnected module (MIM) technology enables to manufacture miniaturized photovoltaic (PV) modules on chip level. 1,2 In such devices, an elevated output voltage on a device level is achieved by a series connection of many electrically separated PV cell segments using standard microelectronic fabrication processing methods. 3 The possibility to increase the output voltage facilitated the use of MIMs in a variety of applications.…”

“…[7][8][9][10][11][12][13] The broad range of applications leads to a variety of geometries (pie-shaped circular, 13 parallel stripes, 3 …materials [GaAs, 13 InGaAs, 14 Si, 15 …]) and monolithic interconnection schemes for MIMs. 1 This diversity presents a challenge to establish simulation methods to accurately model and simulate such devices. To some extent and with a given design symmetry, modeling of MIMs can be accomplished with an analytically solvable lumped model.…”