Monolithic Integrated CMOS-MEMS MOS type Gas Sensor and Novel Heater for Sensitivity and Power Consumption Enhancement

Lee, Ya-Chu; Cheng, Shyh-Wei; Lin, Yu‐Cheng; Fang, Weileun

doi:10.1109/transducers.2019.8808361

Cited by 5 publications

(5 citation statements)

References 13 publications

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“…To properly manage the thermal influences, the heater is an important design consideration. Figure 25 displays a gas sensor integrated with a heater of novel design [159]. The CMOS chip is fabricated by the TSMC 0.35 µm 2P4M standard CMOS process.…”

Section: Sensing Materials Electrodementioning

confidence: 99%

“…Finally, the drop casting method is considered as a solution to deposit the sensing film when the process temperature exceeds the acceptable thermal budget of the CMOS chip. For example, as reported in [159,160], the sensing material (SnO 2 -ZnO) was synthesized using hydrothermal synthesis method with a maximum process temperature of 700 • C which exceeds the thermal budget of CMOS chip. By adopting drop casting, the sensing material can be easily deposited on the CMOS-MEMS chip, as shown in figure 27(b).…”

Section: Sensing Materials Electrodementioning

confidence: 99%

“…Figure 27. The SEM micrograph of different deposition method: (a) spray pyrolysis [170] and (b) drop casting [159]. (a) Reproduced from [170], CC BY NC-ND, and (b) Reproduced from [160].…”

Section: (A) (B)mentioning

confidence: 99%

“…Similar as in for relative humidity detection, the temperature information is needed for the gas sensor to avoid the drift of sensing signals [175]. In addition, the heater can also be fabricated and further integrated with the gas sensor by using the same process scheme, as displayed in figure 25 [159,160]. In this environment sensing hub, the heater is exploited to heat the sensing material.…”

Section: Environment Sensing Hubmentioning

confidence: 99%

“…Thus, by leveraging the characteristics of CMOS processes, the CMOS-MEMS technologies could enable the monolithic integration of different sensors, actuators, and sensing circuits to fulfill diversified requirements for wide applications. For example, the monolithic integration of heater and gas sensor using the CMOS-MEMS technologies are demonstrated in [156][157][158][159][160]. The monolithic integration of humidity and temperature sensors are also achieved in [88,89,117].…”

Section: Conclusion and Future Perspectivesmentioning

confidence: 99%

See 4 more Smart Citations

CMOS-MEMS technologies for the applications of environment sensors and environment sensing hubs

Lee

Hsieh

Lin

et al. 2021

J. Micromech. Microeng.

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The booming growth in environmental conditions sensing and monitoring pushes the need of inexpensive environment sensors with small size and low power consumption. The outbreak of COVID-19 further increases the need for fast monitoring of environment conditions. The micro-electrical-mechanical-systems (MEMS) technologies are considered as promising solutions to realize the required environment sensors. The mature complementary metal-oxide-semiconductor (CMOS) process platforms available in many foundries can be extended to fabricate MEMS sensors to offer the advantage of relatively easier commercialization. Moreover, by leveraging the characteristics of CMOS process platforms, the integration of multiple sensors and sensing circuits to form a compact sensing system can also be achieved. This review paper will focus on introducing the miniaturized environmental sensing devices implemented and integrated using the CMOS-MEMS technologies. In general, the CMOS chips for environment sensing are firstly fabricated using the foundry-available CMOS processes, and then the post-CMOS micromachining processes are performed to implement the CMOS-MEMS environment sensors. This paper respectively reviews five different environment sensors (including the infrared, pressure (barometer), humidity/temperature, and gas sensors) using the CMOS-based MEMS technologies. The advantages and design concerns of sensors fabricated by different CMOS and post-CMOS processes are introduced and discussed. Moreover, the CMOS-MEMS environment sensing hub implemented through the monolithic integration of multiple environment sensors is also introduced.

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Section: Sensing Materials Electrodementioning

confidence: 99%

Section: Sensing Materials Electrodementioning

confidence: 99%

“…Figure 27. The SEM micrograph of different deposition method: (a) spray pyrolysis [170] and (b) drop casting [159]. (a) Reproduced from [170], CC BY NC-ND, and (b) Reproduced from [160].…”

Section: (A) (B)mentioning

confidence: 99%