Abstract:In batch ion implanters, wafers are set on a rotating wafer-disk which has a metal surface exposed to ion beams. In order to reduce metal contamination from the disk, the metal surface is usually coated by Silicon. Because implantation is done to the disk surface as well as wafers, the surface is sputtered and the Silicon coated layer becomes thinner by degrees. When the Silicon coated layer is removed by sputtering, the base disk material (usually aluminum alloy) is exposed to the ion beam, and thus metal con… Show more
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