Monitoring of the curing process of composite structures by tunnelling junction sensors

Torres, Mauricio; Collombet, Francis; Douchin, Bernard; Crouzeix, Laurent; Grunevald, Yves-Henry; Lubin, Jérôme; Camps, Thierry

doi:10.1016/j.sna.2015.10.008

Cited by 7 publications

(9 citation statements)

References 20 publications

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“…This problem is mitigated using a 3D-printed stamp to selectively apply ℓPDMS only to non-channel areas of the PDMS device (Section 'ℓPDMS stamp bonding and multilayer rapid assembly'). Reliability of the bonding process can be further improved through the use of a dedicated bonding platform 19 or through the use of a vacuum-bonding apparatus to provide consistent uniform pressure [58][59][60][61] . For more details on spin bonding and potential improvements, see Supplementary Material S5.3.…”

Section: Resultsmentioning

confidence: 99%

Rapid assembly of multilayer microfluidic structures via 3D-printed transfer molding and bonding

et al. 2016

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A critical feature of state-of-the-art microfluidic technologies is the ability to fabricate multilayer structures without relying on the expensive equipment and facilities required by soft lithography-defined processes. Here, three-dimensional (3D) printed polymer molds are used to construct multilayer poly(dimethylsiloxane) (PDMS) devices by employing unique molding, bonding, alignment, and rapid assembly processes. Specifically, a novel single-layer, two-sided molding method is developed to realize two channel levels, non-planar membranes/valves, vertical interconnects (vias) between channel levels, and integrated inlet/outlet ports for fast linkages to external fluidic systems. As a demonstration, a single-layer membrane microvalve is constructed and tested by applying various gate pressures under parametric variation of source pressure, illustrating a high degree of flow rate control. In addition, multilayer structures are fabricated through an intralayer bonding procedure that uses custom 3D-printed stamps to selectively apply uncured liquid PDMS adhesive only to bonding interfaces without clogging fluidic channels. Using integrated alignment marks to accurately position both stamps and individual layers, this technique is demonstrated by rapidly assembling a six-layer microfluidic device. By combining the versatility of 3D printing while retaining the favorable mechanical and biological properties of PDMS, this work can potentially open up a new class of manufacturing techniques for multilayer microfluidic systems.

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Section: Resultsmentioning

confidence: 99%

Rapid assembly of multilayer microfluidic structures via 3D-printed transfer molding and bonding

et al. 2016

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“…Tunnelling junction sensors (TJS) are electronic devices which take advantage of inverse polarization of P -N junctions. During the last decade, the LAAS has tested the TJS on microfluids applications and as thermal micro-actuators [16,17]. The TJS consist in a silicon polycrystalline prism doped with Phosphorus and Bore by low-pressure chemical vapour deposition (LPCVD) to form P -N junctions.…”

Section: Tunnelling Junction Sensors (Tjs)mentioning

confidence: 99%

“…The interest on the tunnelling effect conduction lays onto its dependence to temperature changes [16]. The sensibility to temperature changes becomes evident when the polarization current gets a value within the tunnel effect interval.…”

Section: Tunnelling Junction Sensors (Tjs)mentioning

confidence: 99%

“…TJS employed in this study case have 2×2×0.3 mm as nominal dimensions and they are glued onto a flex Kapton® wire, as depicted in figure 1-c. For TJS polarization, a SMU 2612 Keithley® power source controlled by Labtracer software is used. Efficient study cases of TJS manufacturing and electrical-thermal response are fully described in [16,17].…”

Section: Tunnelling Junction Sensors (Tjs)mentioning

confidence: 99%

“…Based on the state-of-the-art knowledge, new sensors based on improved materials' science features have been promoted. On the electric devices side, tunnelling junction sensors (TJS) [16,17] and flexible ultrasonic transducers (FUT) [18][19][20] are attracting researchers' attention.…”

Section: Introductionmentioning

confidence: 99%

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Multi-instrumentation monitoring for the curing process of a composite structure

et al. 2020

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This is a PDF file of an article that has undergone enhancements after acceptance, such as the addition of a cover page and metadata, and formatting for readability, but it is not yet the definitive version of record. This version will undergo additional copyediting, typesetting and review before it is published in its final form, but we are providing this version to give early visibility of the article. Please note that, during the production process, errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.

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Mode I interlaminar fracture toughness of carbon‐epoxy coupons with embedded ceramic sensors

et al. 2017

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This study analyses the mechanical and crack growth behavior of woven carbon fiber reinforced plastics (CPRF) with embedded ceramic sensors. The material studied here is 3K-70-P carbon fiber plain weave with EPOLAM 2015® epoxy resin. The composite is manufactured with vacuum bagging procedure. Later on, the composite Mode I interlaminar fracture toughness (G IC ) is calculated by means of double cantilever beam tests (DCB) for two layout configurations [0/90] and [±45] with and without embedded sensors. Results give an initial approach of the fracture behavior of an instrumented composite facing an interlaminar crack. The interlaminar fracture toughness for the instrumented specimens is lower compared to the noninstrumented coupons. The presence of the sensor and its wire connection has a considerable impact on the damage tolerance of the woven composite, where the sensors surroundings seem to be the more likely region to be affected by an interlaminar fracture. K E Y W O R D S carbon fibers, delamination, fractography, fracture toughness F I G U R E 5 Load-displacement curve for [±45] double cantilever beam coupons [Colour figure can be viewed at wileyonlinelibrary.com] Reference With Peak load = 105 N, Peak load = 45 N, With How to cite this article: Torres M, Tellez RA, Hernández H, Camps T. Mode I interlaminar fracture toughness of carbon-epoxy coupons with embedded ceramic sensors.

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Monitoring of the curing process of composite structures by tunnelling junction sensors

Cited by 7 publications

References 20 publications

Rapid assembly of multilayer microfluidic structures via 3D-printed transfer molding and bonding

Rapid assembly of multilayer microfluidic structures via 3D-printed transfer molding and bonding

Multi-instrumentation monitoring for the curing process of a composite structure

Mode I interlaminar fracture toughness of carbon‐epoxy coupons with embedded ceramic sensors

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