Molecular dynamics study on grinding mechanism of polycrystalline silicon carbide

Chen, Minghao; Dai, Houfu

doi:10.1016/j.diamond.2022.109541

Cited by 17 publications

(2 citation statements)

References 40 publications

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“…MD simulations can reproduce transient removal characteristics during chip grinding, which is difficult to capture in a grinding experiment, and quantitatively analyze the damage accumulation and material removal behaviors induced by abrasive machining [49][50][51]. These simulations can elucidate the influence of coupling actions of abrasive particles on the stress distribution [52], phase transition [53], grinding force [54], and coefficient of friction [55] during grinding process, which can provide a beneficial guidance for the optimization of grinding processes. Nevertheless, however, no MD simulations of doublegrit grinding of GaN semiconductors have been reported thus far.…”

Section: Introductionmentioning

confidence: 99%

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Li,

Hu,

Wei

et al. 2024

Int. J. Extrem. Manuf.

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Understanding the complex interactions between the work material and abrasives is a difficult and hot topic during grinding of Gallium nitride (GaN) single crystals. In this work, molecular dynamics (MD) simulations of double-grits interacted grinding of GaN crystals were performed, and the grinding force, coefficient of friction, stress distribution, plastic damage behaviors, and abrasive damage were systematically investigated. The results demonstrated that interacted distance with both radial and transverse directions achieved better grinding quality than that with only one direction or single-grit grinding. The grinding force, grinding induced stress, subsurface damage depth, and abrasive wear increases as the transverse interacted distance increases. However, the influence laws of the interacted distance on atom number of phase transition and dislocation length are not distinct. Appropriate interacted distances between abrasives can decrease grinding force, coefficient of friction, grinding induced stress, subsurface damage depth, and abrasive wear during the grinding process. Grinding test combined with the cross-sectional TEM detection verified the reliability of the simulated damage behaviors, i.e. amorphous, high-pressure phase transition, dislocations, stacking faults, and lattice distortions. The results not only enhance the understanding of damage accumulation and material removal caused by the coupling actions of abrasives in grinding process, but also provide a feasible approach for the wheel design of ordered abrasives.

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Section: Introductionmentioning

confidence: 99%

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Li,

Hu,

Wei

et al. 2024

Int. J. Extrem. Manuf.

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show abstract

“…One example of abrasive machining carried out in this way is the grinding processes used in the manufacture of dies [2] or crankshafts [3]. Both types of grinding operations require tools of different designs (abrasive grains [4][5][6], bonds [7], structures [8], hardness [9], susceptibility [10], and elasticity [11]) and different technological parameters.…”

Section: Introductionmentioning

confidence: 99%

Effect of the Axial Profile of a Ceramic Grinding Wheel on Selected Roughness Parameters of Shaped Surfaces Obtained in the Grinding Process with a Dual-Tool Grinding Head

Jaskólski,

Sutowska,

Zawadka

et al. 2024

Materials

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The use of CNC equipment that integrates several machining operations eliminates downtime due to changes in setup and clamping of workpieces in more than one machining device. A review of CNC equipment and tools known from the literature and from manufacturers’ offerings indicates that new technical solutions are being developed to integrate two or more technological operations. However, these examples have numerous limitations and are mostly not suitable for machining surfaces with complex shapes. An example of such solutions is the use of a dual-tool grinding head, which integrates the process of rough grinding with a ceramic grinding wheel and finish grinding with a flexible grinding wheel. Unfortunately, it has the disadvantage of being limited by the angular shape of the ceramic grinding wheel, making it unable to adapt to the complex geometries of the shaped surfaces being ground. The need to overcome this limitation became the motivation for the research work described in this article. By means of experimental research, it was verified what effect the radial outline on the periphery of a ceramic grinding wheel realized by rough grinding would have on the surface roughness parameters obtained in the process of grinding shaped surfaces. For this purpose, grinding processes using a ceramic wheel with a conical and radial outline were compared. The result of the study was a summary of the surface roughness parameters Sa, St, Sq, Spk, Str, and Sds obtained after two-stage machining (rough and finish grinding). The obtained analysis results showed that changing the axial outline of the ceramic grinding wheel makes it possible to significantly expand the range of applications of the dual-tool head without negatively affecting the quality of the machined surface. Thus, such an improvement will make it possible to increase the applicability of the head by grinding shaped surfaces with a radial profile of curvature.

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Molecular dynamics simulation-based study of single-crystal 3C-SiC nano-indentation with water film

Ou,

Wu,

Dai

2023

Appl. Phys. A

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Molecular dynamics study on grinding mechanism of polycrystalline silicon carbide

Cited by 17 publications

References 40 publications

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding

Effect of the Axial Profile of a Ceramic Grinding Wheel on Selected Roughness Parameters of Shaped Surfaces Obtained in the Grinding Process with a Dual-Tool Grinding Head

Molecular dynamics simulation-based study of single-crystal 3C-SiC nano-indentation with water film

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