2012
DOI: 10.1016/j.apsusc.2012.01.009
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Molecular dynamics simulations of the temperature effect in the hardness on Cr and CrN films

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Cited by 25 publications
(7 citation statements)
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“…Accordingly, it can be concluded that as the temperature increases the elastic modulus and hardness of the sample decrease. This is consistent with previous work 40,41 that states with the increase of the temperature, the hardness, and elastic modulus decrease.…”
Section: Discussionsupporting
confidence: 94%
“…Accordingly, it can be concluded that as the temperature increases the elastic modulus and hardness of the sample decrease. This is consistent with previous work 40,41 that states with the increase of the temperature, the hardness, and elastic modulus decrease.…”
Section: Discussionsupporting
confidence: 94%
“…There is little difference of Ph curves among 300 K, 700 K, and 1000 K. However, there is a trend among the forces at different higher temperatures, which is 300 K > 700 K > 1000 K . In other words, all of the P-h curves agree with the previous reports [27,28] that the hardness decreases with the temperature increasing.…”
Section: Indentation Force-depth Curvessupporting
confidence: 91%
“…Therefore, a thin Cr film is pre-deposited on the surface of CoCrNiSi 0.3 MEA as a buffer layer. The thickness of the Cr buffer layer is 0.9 μm, and its hardness is reported to be about 8.05 GPa [ 32 ]. The sputtering parameters of the Cr buffer layer were set at a working pressure of 0.8 Pa, a bias voltage of −35 V, an Argon input flow rate of 45 sccm, an applied DC power of 100 W, and a sputtering time of 15 min.…”
Section: Methodsmentioning
confidence: 99%