In
ferroelectric-based integrated devices, there are usually buffer
layers between ferroelectric films and semiconductor substrates. Here,
Bi
x%FeO3−δ (x = 95, 100, and 105) (BFOx) films are
prepared directly on n-Si substrates by the sol–gel method,
and the variation of the hysteresis loops with Bi content and heat
treatment is investigated. With the help of the dielectric measurement
and the composition analysis, a PN heterojunction is believed to exist
at the BFOx/Si interface. The Bi/Fe ratio determines
not only the type and concentration of charged defects in the films
but also the height of the interface barrier and its binding effect
on mobile charges. Furthermore, the distribution and the migration
of charges can be regulated reversibly by heat treatment. This work
reveals the interaction between ferroelectric films and semiconductor
substrates, providing an important reference for the design and application
of ferroelectric/semiconductor heterostructures.