Molecular dynamics simulation of the nano- reinforced lead-free solder at different reflow soldering process temperature

Abstract

Temperature plays an important role in the reflow soldering process. Reflow soldering process which involving four basic stages including preheating, soaking, reflow and cooling require a specific range of temperature at each stage and the highest temperature is the reflow stage. In this study, the movement of the reinforced nanoparticles in the lead-free solder at three different stage temperatures which are 30°C,150°C and 250°C will be shown via Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) software. The simulation model able to show the movement of nanoparticles in the solder at three different reflow soldering process stages. The most vigorous movement of nanoparticles is shown at the temperature of 250°C while the least vigorous movement is shown at room temperature of solder which is at 30°C.

Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven

“…In Table 2, Pr is the Prandtl number, ν is the kinematic viscosity and k is the thermal conductivity. The nozzle-matrix gas flow velocity V e in each temperature zone can be calculated by Equations ( 9) and (10) and is shown in Table 3. Here, h c is the average heat convection coefficient and V e is the nozzle-matrix gas flow velocity.…”

“…In these cases, a numerical simulation-based approach for the PCBA reflow soldering process has become an important and essential method due to its inherent advantages such as relative short time, low cost and no consumption of the physical products. There are several ways to simulate the reflow soldering process, including the finite element method (FEM) [4], finite volume method (FVM) [5,6], fluid-structure interface (FSI) [7], lattice Boltzmann's method (LBM) [8], discrete phase method (DPM) [9] and molecular dynamic (MD) [10]. Whall et al [11] used ANSYS finite element analysis software to conduct temperature field simulation of 2-D PCBA components and obtained simulated temperature data.…”