Molecular dynamics simulation of the influence of elliptical void interaction on the tensile behavior of aluminum

Cui, Yi; Chen, Zengtao

doi:10.1016/j.commatsci.2015.06.028

Cited by 30 publications

(6 citation statements)

References 63 publications

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“…On the other hand, while theoretical models based on continuum elastic theory have been developped to take into account the effects of ellipticity on the void growth in plastic deformation of metals [28], mechanisms for such effects at the nanoscale remain largely unknown. Recently, an attempt has been made to investigate the growth and coalescence of initially elliptic voids in Al, which highlights the significance of the initial void ellipticity in mechanical responses of voided metallic thin films subject to tension [29,30].…”

Section: Introductionmentioning

confidence: 99%

On the role of initial void geometry in plastic deformation of metallic thin films: A molecular dynamics study

2016

Materials Science and Engineering: A

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Section: Introductionmentioning

confidence: 99%

On the role of initial void geometry in plastic deformation of metallic thin films: A molecular dynamics study

2016

Materials Science and Engineering: A

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“…Tang et al [27] similarly reported such a slip-to-twinning transition as the strain rate increases, in a voided BCC Ta model subject to a uniaxial tensile strain or a hydrostatic tensile loading; their MD simulations also revealed a special type of dislocation shear loop at the void surface that can expand as partial or perfect dislocations, evolving into prismatic loops through reaction with each other or developing into twins [28]. However, the atomic-scale mechanisms of the effects of the initial void geometry in nanovoid growth, which have recently been explored in FCC metals [16,19,29], remain largely unknown in BCC metals.…”

Section: Introductionmentioning

confidence: 99%

Nanovoid growth in BCCα-Fe: influences of initial void geometry

2016

Modelling Simul. Mater. Sci. Eng.

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The growth of voids has a great impact on the mechanical properties of ductile materials by altering their microstructures. Exploring the process of void growth at the nanoscale helps in understanding the dynamic fracture of metals. While some very recent studies looked into the effects of the initial geometry of an elliptic void on the plastic deformation of face-centered cubic metals, a systematic study of the initial void ellipticity and orientation angle in body-centered cubic (BCC) metals is still lacking. In this paper, large scale molecular dynamics simulations with millions of atoms are conducted, investigating the void growth process during tensile loading of metallic thin films in BCC α-Fe. Our simulations elucidate the intertwined influences on void growth of the initial ellipticity and initial orientation angle of the void. It is shown that these two geometric parameters play an important role in the stress-strain response, the nucleation and evolution of defects, as well as the void size/outline evolution in α-Fe thin films. Results suggest that, together with void size, different initial void geometries should be taken into account if a continuum model is to be applied to nanoscale damage progression.

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“…In recent years, atomistic simulations have been widely used as a powerful tool to investigate all kinds of structural performance regarding various nanostructures [23][24][25][26][27][28][29][30][31][32][33][34]. Our atomistic simulations here are conducted by using the software package LAMMPS [35].…”

Section: Simulation Methodologymentioning

confidence: 99%

Nanotwinning and tensile behavior in cold-welded high-entropy-alloy nanowires

Toku

2021

Nanotechnology

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Since the fabrication technique for high-entropy alloy (HEA) nanowires/nanopillars is still in its infancy, neither experimental nor modeling analyses of their cold-welding performance have been reported. Based on insights accumulated in our previous experiments and simulations regarding cold-welded metallic nanowires, in this study, the cold-welding performance of HEA nanowires is probed by atomistic simulations. Among different materials, our simulations reveal that extensively twinned structures are formed in CoCrMnFeNi samples, but not in CoCrCuFeNi or Ni samples. The larger fracture strain in certain HEAs is due to the improved ductility around the fracturing area as well as multiple twinning. Unlike in Ni samples, the fracture strains in HEA samples, regardless of being cuboid or cylindrical, are improved by shrinking the sample size. Among different orientations, the [010]-direction monocrystalline nanowires fail at a strain over 0.6, which is almost double that of the [111] direction. The fracture strains in polycrystalline HEA samples are, on average, larger than those in polycrystalline Ni samples. Furthermore, fracture strains in randomly generated polycrystalline HEA samples are more predictable than those in polycrystalline Ni samples with identical grain configurations. As previously reported, dislocation emission is still a prerequisite to fracture in all cold-welded samples.

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Molecular dynamics simulation of the influence of elliptical void interaction on the tensile behavior of aluminum

Cited by 30 publications

References 63 publications

On the role of initial void geometry in plastic deformation of metallic thin films: A molecular dynamics study

On the role of initial void geometry in plastic deformation of metallic thin films: A molecular dynamics study

Nanovoid growth in BCCα-Fe: influences of initial void geometry

Nanotwinning and tensile behavior in cold-welded high-entropy-alloy nanowires

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