2010
DOI: 10.1143/jjap.49.04dn08
|View full text |Cite
|
Sign up to set email alerts
|

Molecular Dynamics Simulation of Heat Transport in Silicon Nano-structures Covered with Oxide Films

Abstract: We perform a series of molecular dynamics (MD) simulations to investigate the heat transport in Si nano-structures, while explicitly including oxide cover layers in the simulation system for the first time. The dependences of thermal diffusion velocity on the thicknesses of the SiO2 film and Si lattice are investigated. The results show that thermal diffusion velocity decreases with Si lattice thickness and does not depend on SiO2 film thickness.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2

Citation Types

0
6
0

Year Published

2010
2010
2016
2016

Publication Types

Select...
4
4

Relationship

2
6

Authors

Journals

citations
Cited by 9 publications
(6 citation statements)
references
References 17 publications
0
6
0
Order By: Relevance
“…In the practical NW, the SiO 2 film would modify the phonon energy dispersion, and thus phonon energy spectrum, group velocity and relaxation time, due to the oxide-induce strain and SiO 2 /Si interface roughness. 5,6,20,21 Therefore the insulating oxide film should be included in the simulation system.…”
mentioning
confidence: 99%
“…In the practical NW, the SiO 2 film would modify the phonon energy dispersion, and thus phonon energy spectrum, group velocity and relaxation time, due to the oxide-induce strain and SiO 2 /Si interface roughness. 5,6,20,21 Therefore the insulating oxide film should be included in the simulation system.…”
mentioning
confidence: 99%
“…It is theoretically shown in ref. 16 that a high uniaxial strain greater than 0.5% plays an important role in the nonlinear carrier mobility enhancement. In this lowstrain region, it is considered that the linear relation of eq.…”
Section: Discussionmentioning
confidence: 99%
“…17) For example, on the basis of the k Á p perturbation theory, the hole transport has been analyzed in p-channel biaxially strained Si inversion channel, and the nonlinear mobility enhancement is presented for compressive strains. 16) Although the definite origin is unclear at present, biaxial horizontal compressive strains possibly cause this peculiar phenomenon. As described, when the vertical weight is applied on the local region of the chip, a horizontal compressive stress, as well as a vertical one, is generated at the region.…”
Section: Discussionmentioning
confidence: 99%
“…12 Molecular dynamics (MD) is known as a rigorous simulation method for analyzing heat transfer properties in atomic scale structures; however, its application to realistic device structures would be impractical because of the huge computational cost. 13,14 In addition, nonequilibrium Green's function (NEGF) method has been recently adopted to the phonon transport simulation, which is suitable to assess the heat transfer in the ballistic limit. [15][16][17] The Monte Carlo (MC) method for directly solving the phonon Boltzmann transport equation (BTE) is considered to be a useful approach for simulating the heat transfer in realistic nanoscale devices structures with an adequate balance of accuracy and computational efficiency and expansion for the realistic complex device structures.…”
Section: Introductionmentioning
confidence: 99%