Molecular Dynamics Investigation of Nanometric Cutting of Single-Crystal Silicon Using a Blunt Tool

Kalkhoran, Seyed Nader Ameli; Vahdati, Mehrdad; Yan, Jiwang

doi:10.1007/s11837-019-03671-w

Cited by 13 publications

(3 citation statements)

References 38 publications

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“…As the grain radius increases from 4 nm to 12 nm, the critical RGS for ploughing to cutting transition decreases from 0.45 to 0.25. It is worth mentioning that in previous research on nanometric cutting, the critical RTS for the transition of material removal mechanism is nearly constant for certain materials and cutting directions [48]. This difference can be attributed to the threedimensional model adopted in this simulation.…”

Section: Materials Removal Mechanismmentioning

confidence: 90%

“…It is observed that when the grinding depth reaches 6 nm, most atoms are piled up to the uncut surface as the radius of the grains is set as 8 nm. In nanometric cutting, the critical depth for the transition of the material removal mechanism is greatly determined by the geometric relationship between the depth of cut and tool edge radius, which can be measured by the relative tool sharpness (RTS) [48,49]. In this research, the ratio of the transient grinding depth and grain radius is defined as the relative grain sharpness (RGS) to describe the geometric relationship between grinding depth and grain size.…”

Section: Materials Removal Mechanismmentioning

confidence: 99%

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Numerical Investigation on the Effects of Grain Size and Grinding Depth on Nano-Grinding of Cadmium Telluride Using Molecular Dynamics Simulation

Liu,

Yip,

et al. 2023

Nanomaterials

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Cadmium telluride (CdTe) is known as an important semiconductor material with favorable physical properties. However, as a soft-brittle material, the fabrication of high-quality surfaces on CdTe is quite challenging. To improve the fundamental understanding of the nanoscale deformation mechanisms of CdTe, in this paper, MD simulation was performed to explore the nano-grinding process of CdTe with consideration of the effects of grain size and grinding depth. The simulation results indicate that during nano-grinding, the dominant grinding mechanism could switch from elastic deformation to ploughing, and then cutting as the grinding depth increases. It was observed that the critical relative grain sharpness (RGS) for the transition from ploughing to cutting is greatly influenced by the grain size. Furthermore, as the grinding depth increases, the dominant subsurface damage mechanism could switch from surface friction into slip motion along the <110> directions. Meanwhile, as the grain size increases, less friction-induced damage is generated in the subsurface workpiece, and more dislocations are formed near the machined groove. Moreover, regardless of the grain size, it was observed that the generation of dislocation is more apparent as the dominant grinding mechanism becomes ploughing and cutting.

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Section: Materials Removal Mechanismmentioning

confidence: 90%

Section: Materials Removal Mechanismmentioning

confidence: 99%

Numerical Investigation on the Effects of Grain Size and Grinding Depth on Nano-Grinding of Cadmium Telluride Using Molecular Dynamics Simulation

Liu,

Yip,

et al. 2023

Nanomaterials

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“…It was observed that the coefficient of friction was significantly high due to the lack of contaminant on the machining surface. Recently, Kalkhoran et al [6,7] applied MD to study the effect of tool geometry in nano-scale machining process. They found that relative tool sharpness (RTS) had a profound impact on chip formation and surface integrity.…”

Section: Introductionmentioning

confidence: 99%

Molecular dynamics investigation into the effect of nano-void size on cutting parameters in copper single crystal

et al. 2021

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In this paper, using the EAM potential, three-dimensional Molecular Dynamics simulations were carried out to study the effect of spherical nano-void and its size on nano-cutting parameters of copper. Then, a comparison was made with a perfect single crystal. The numerical results revealed that due to high hydrostatic pressure during nano-scale cutting, the nano-void was crumpled indicating that void inclusion in material can influence tool forces if the void diameter is bigger than the depth of cut and if it is placed near the machining surface. Further, the existence of spherical nano-cavity in workpiece affects the uniformity of chip formation proportional to void size. In workpiece with large void, large plastic deformation occurs in two regions: at machining surface due to chip formation and in adjacent void areas because of void crumpling. Finally, in defected workpiece with a large void diameter, the compressive stress area between machining surface and void is transformed to shear stress.

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A Study on the Influence of Cutting Tool Geometry on the Temperature of the Workpiece in Nanometric Cutting of Silicon

Gupta

Ramkumar

2022

Lecture Notes in Mechanical Engineering

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Molecular Dynamics Investigation of Nanometric Cutting of Single-Crystal Silicon Using a Blunt Tool

Cited by 13 publications

References 38 publications

Numerical Investigation on the Effects of Grain Size and Grinding Depth on Nano-Grinding of Cadmium Telluride Using Molecular Dynamics Simulation

Numerical Investigation on the Effects of Grain Size and Grinding Depth on Nano-Grinding of Cadmium Telluride Using Molecular Dynamics Simulation

Molecular dynamics investigation into the effect of nano-void size on cutting parameters in copper single crystal

A Study on the Influence of Cutting Tool Geometry on the Temperature of the Workpiece in Nanometric Cutting of Silicon

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