Molecular dynamics-based cohesive zone representation of microstructure and stress evolutions of nickel intergranular fracture process: Effects of temperature

Wu, Wen Bing; Li, Nanlin; Li, Yun-Li

doi:10.1016/j.commatsci.2015.12.001

Cited by 27 publications

(3 citation statements)

References 40 publications

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“…Many significant investigations have been carried out using this method. The process of intergranular fracture of nickel was studied by Wu [8]. The microstructure and stress distribution during crack extension at different temperatures were analyzed in particular.…”

Section: Introductionmentioning

confidence: 99%

Molecular dynamics simulation of intergranular fracture in austenitic steel containing precipitation

Wei,

Wang,

Hao

et al. 2024

Phys. Scr.

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Molecular dynamics simulation is applied to study the crack propagation in austenitic steel containing precipitation. Based on the experimental results, models containing precipitation with two shapes and three volume fractions are constructed. The interactions of the crack with precipitation, dislocation, twin and stacking faults are investigated. It demonstrates that the crack propagation process is strongly related to the temperature and the characteristic parameter of the precipitation. However, the microstructure evolution and dislocation emission are more affected by the temperature. At the same temperature, the initial emission position of the dislocation is changed due to the variation of the precipitation shape. It also indicates that the peak dislocation density is weakly correlated with the single characteristic parameter of the precipitation. Combined with the variation of the crack propagation rate and the peak dislocation density with temperature, it illustrates a negative relationship between these two results.

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Section: Introductionmentioning

confidence: 99%

Molecular dynamics simulation of intergranular fracture in austenitic steel containing precipitation

Wei,

Wang,

Hao

et al. 2024

Phys. Scr.

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“…At the continuum level, the CZM has been widely used to study the interfacial fracture process as it can avoid stress singularity at the crack-tip and represent the physics of the fracture process at the atomic scale (Yamakov et al, 2006;Ural et al, 2009;Wu et al, 2016).…”

Section: Finite Element Methodsmentioning

confidence: 99%

“…Since the introduction of the CZM in the FEM, many works have been performed to solve problems such as crack tip fracture and interfacial cracks in bilayer systems as it can avoid stress singularity at the crack-tip and represent the physics of the fracture process at the atomic scale (Yamakov et al, 2006;Ural et al, 2009;Wu et al, 2016). Despite its advantages, the outcome of the CZM is still rather limited as its accuracy is highly dependent on the input cohesive parameters.…”

Section: Cohesive Zone Modellingmentioning

confidence: 99%

Failure analysis and characterization for microelectronic packaging

Lin¹

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In the recent years, the mechanical robustness and reliability of three-dimensional (3D) integrated circuit (IC) packaging have become tremendously challenging due to its continuous reduction in size and increase in vertical integration. Thermal problems such as the silicon (Si) substrate cracking and interfacial delamination are increasingly dominant due to the presence of high heat density in the small multilayer IC packaging. Furthermore, as the manufacturing and processing steps of the 3D ICs are significantly different from that of the conventional ICs, new defect and failure mechanisms that are unique to 3D ICs are not wellinvestigated. The reduction in size has also increased the sensitivity of the 3D ICs to microdefects that had not previously threatened their reliability and integrity. The increased complexity and miniaturization of 3D IC packaging and its consequential problems demand for new failure analysis methods. Therefore, this PhD research is proposed to study the physical failure modes and mechanisms associated with 3D ICs via molecular dynamics (MD) simulation and finite element method (FEM), and to develop new failure analysis methods for packaging characterization, thereby improving the packaging techniques and processes.Si is commonly used as a substrate material in the IC packaging but yet its fracture behavior theoretical framework is still not well-developed. Thus, studies are first carried out on Si to understand its fracture mechanism through MD simulation and experiment. As the mechanical properties of Si are strongly influenced by the crystallographic orientation, defects, grain boundary (GB) and temperature, their effects on the tensile properties and failure mechanisms of Si are investigated. The results show that when Si is subjected to tensile loading, it undergoes brittle fracture and its (111) plane is the most favorable cleavage plane due to its high atomic packing density, thus resulting in the highest stiffness and lowest

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Molecular Dynamics Simulation on Intergranular Crack Propagation Along ∑3 Tilt Grain Boundary in Bcc Iron

Zhao

Qin

et al. 2019

Lecture Notes in Mechanical Engineering

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Molecular dynamics-based cohesive zone representation of microstructure and stress evolutions of nickel intergranular fracture process: Effects of temperature

Cited by 27 publications

References 40 publications

Molecular dynamics simulation of intergranular fracture in austenitic steel containing precipitation

Molecular dynamics simulation of intergranular fracture in austenitic steel containing precipitation

Failure analysis and characterization for microelectronic packaging

Molecular Dynamics Simulation on Intergranular Crack Propagation Along ∑3 Tilt Grain Boundary in Bcc Iron

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