Molecular dynamic study of combined effects of diamond tool rake angle and d&lt;SUB align="right"&gt;uncut/R&lt;SUB align="right"&gt;edge ratio on nanomachining behaviour of monocrystalline optical silicon

Abdulkadir, Lukman N.; Hossein, Khaled Abou El; Liman, Muhammad Mukhtar; Odedeyi, Peter Babatunde; Jumare, Abubakar I.

doi:10.1504/ijcmsse.2019.104700

Cited by 1 publication

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“…These forces govern the tool's cutting action [31,46] and are determined by summing up all the Silicon yield was also determined using maximum shear stress and hydrostatic pressure which were derived from equations (3) and (4) [4,31,47]. Equation (5) (von Mises stress) was used to determine the inception of yield stress which is believed to occur at the onset of plastic yield [48,49].…”

Section: Methodsmentioning

confidence: 99%

“…Also, as the thrust force reduction resulted to elevated temperature, the workpiece interatomic increases, leading to a reduction in interatomic bonding energy and an increase rate of SiC bonding thereby causing increase rate of wear. The SiC bonding between silicon and carbon atoms which have been proven [39,49,81,82] to occur during diamond tool wear was investigated through MD. A plot of radial distribution function g(r) and interatomic distance (Å) which helped in tracking the chemical activities between the tool and workpiece atoms was constructed (figure 13).…”

Section: Factor Influence On Kinetic Frictionmentioning

confidence: 99%

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Nanometric behaviour of monocrystalline silicon when single point diamond turned—a molecular dynamics and response surface methodology analysis

et al. 2020

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Hard and brittle materials such as silicon and silicon carbide are widely used in aerospace and integrated circuit. They are often poorly machined owing to non-linearity in machining process and complexities in selecting suitable machining parameters and tool geometry. The experimental difficulty involved in observing nanoscale physical phenomena (i.e. in-process measurement problems, inaccessible contact area of tool and workpiece, and the difficulty of surface analysis) has led to the use of molecular dynamics (MD) and response surface methodology (RSM) to investigate effect of tool edge radius, rake and clearance angles on monocrystalline silicon in this research. The response of subsurface deformation depth (SSD), tool temperature, kinetic friction cutting and thrust forces to tool edge radius, rake and clearance angles showed that SSD increased as the rake angle, edge radius and clearance angle increased while kinetic friction reduced as they increased. The increase in SSD as the clearance angle increased as observed in this study can be associated to the interactive/combined influence of the effects of both edge radius and rake angle.

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