Abstract:Low-k dielectrics materials in the active layers on the chip surface has become a hot topic as most 90nm devices and all 65nm devices utilize low-k dielectrics materials. Low-k dielectrics materials provide a significant increase in performance of the devices but lowk materials have very low mechanical strength compared to the traditional dielectric films due to their porous nature, which results in low strength and poor adhesion qualities of the low-k dielectric materials. These lead to a unique set of mechan… Show more
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