2022 International Electron Devices Meeting (IEDM) 2022
DOI: 10.1109/iedm45625.2022.10019522
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MOL Local Interconnect Innovation: Materials, Process & Systems Co-optimization for 3nm Node and Beyond

Ashish Pal
1
,
G. Thareja
2
,
S. Dağ
3
et al.
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