Abstract:This paper presents an experimental and computational study done on an epoxy to determine the effect of moisture level and temperature on the Coefficient of Hygroscopic Swelling (CHS). When a non-hermetic package is exposed to a humid environment, the adhesives used in the package absorb moisture and swell. This can induce stresses in the package that can lead to failure. The Coefficient of Hygroscopic Swelling is defined as the ratio of hygroscopic strain to the moisture concentration in the material. It has … Show more
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